TE Connectivity’s (TE) AMPMODU small centerline interconnection systems are fine pitch 1mm [0.0394”] connectors that offer 85% space savings on the board when compared to standard 2.54mm pitch products. Their dual-beam contact design provides a reliable electrical connection even in severe shock and vibration environments. To serve a broad range of design requirements, the portfolio offers up to 100 positions with 2 plating options and supports automated surface mounting and reflow processes.

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