The Murata's crystal units XRCGB series use the world's first unique packaging technology that is not offered in existing crystal units. This packaging technology provides excellent quality, mass productivity and cost performance.
Structure
Small and High-Reliability Packages
- 2.0mm x 1.6mm sizes allow for ECU downsizing
- These package sizes enable a maximum of 60% downsizing capabilities compared to the 3.2mm x 2.5mm size
- This package combines mechanical and weather-resistant performance with excellent shock and drop shock resistance
Particles That Obstruct Oscillation
Murata's original particle screening technology ensures the removal of defective products with particles that can deteriorate quartz crystal characteristics during production. (Patent technology No. 4998620)
Introduction of Termination Design Suitable for AOI
Murata has adopted corner electrode terminations to improve solder fillet visibility while maintaining a compact design. AOI: Automatic Optical Inspection (Board visual inspection)
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Features
- Small Size 2.0mm x 1.6mm x 0.7mm for 16MHz to 50MHz
- Economical & Robust Design
- Simple structure using Murata’s proven package technology
- Particle screening process for enhanced reliability
Applications
- Wireless Application (WiFi, BT, BLE, UWB,NFC, Zigbee)
- Wired Application (Ethernet, USB2.0/3.0)
- Processor (CPU, MPU, DSP)
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