The PAH series is ideal for power amplifier applications, semiconductor test equipment, wireless networks, and telecom applications. The baseplate provides a means for conduction cooling in demanding thermal environment conditions. The module provides a 53VDC or 48VDC output at 8.5A and accepts a wide input voltage range of 36VDC to 75VDC. The PAH topology offers high efficiency (up to 94%), tight line and load regulation, low ripple/noise, and a fast dynamic load response. A single-board, highly optimised thermal design contributes to the superior thermal performance.
These half-bricks provide output trim, sense pins, and primary side ON/OFF control. Standard features also include input under-voltage shutdown, output over-voltage protection, output short-circuit/current limiting protection, and thermal shutdown.

Features | Applications |
---|---|
|
|

Ask an expert
Have a question? Our regional technical specialists are on hand to help.