Molex’s Micro-Fit product family consists of 3mm pitch connectors with a maximum current rating of 8.5A; available in multiple circuit sizes and cable lengths for power/signal, blind-mating, wire-to-wire, wire-to-board and board-to-board and some cable assembly applications.
The family includes:
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Micro-Fit 3.0 Connectors are a 3mm pitch high-density, low-power connector system available in wire-to-wire and wire-to-board configurations with SMT and through-hole options and up to 8.5A to meet low- to mid-range power application needs.
Molex’s Micro-Fit 3.0 interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3mm centerline, Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single- and dual-row versions. Micro-Fit 3.0 connectors can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilise positive-lock features to prevent accidental disconnects. Micro-Fit 3.0 interconnects are UL recognised, CSA approved and TUV licensed. All components are leadfree, RoHS compliant, halogen free and glow wire capable.
Micro-Fit BMI connectors allow mating misalignment up to 2.54mm (.100") with a maximum current rating of 5A, making these connectors ideal for wire-to-wire, wire-to-board and board-to-board blind-mating applications.
Molex’s Micro-Fit BMI connectors are designed for hard to reach applications where it is not feasible for the connectors to be seen while engaging/disengaging, such as in a drawer or fan assembly tray; and to permit self-alignment of the connectors, eliminating the need for direct line of sight, and assuring a good interface. Panel mounted plugs and receptacles are available for wire-to-wire applications, while pcb-mounted receptacles and headers permit wire to board and board-to-board designs. All versions are available in tin and select gold in 2 to 24 circuit dual row versions.
Micro-Fit CPI connectors handle a current rating up to 5A eliminating the need for soldering for wire-to-board configurations.
Molex’s Micro-Fit CPI connectors eliminate the need to solder headers into the PCB by providing a compliant pin interface, while maintaining all the features of the standard Micro-Fit 3.0. The robust “eye of the needle” design provides a reliable interface between the terminal and the PCB when recommended board layouts are followed. The Micro-Fit CPI mates with the Micro-Fit 3.0 receptacles, which allows users to make running changes to their PCBs as the boards transition from solder to press fit applications permitting the contact interface to remain the same. CPI is available in a vertical orientation in 2 to 24 circuit versions and is available in a vertical blind mating (BMI) version.
Micro-Fit RMF terminals are crimp terminals designed for 30% lower engagement and disengagement forces and increased cycling durability.
Micro-Fit RMF terminals are designed for applications using gold contacts, when there is need for lower engagement and disengagement forces or the units are cycled frequently. Micro-Fit RMF mating forces are reduced as much as 30% over the standard terminal. For increased durability, pre-lubricated version can be cycled up to 250 times. An additional benefit is that the terminals fit into standard Micro-Fit housings, eliminating the need for product redesigns. Micro-Fit RMF is available in 20AWG to 24AWG and 26 to 30AWG.
| Features | Applications | |
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Micro-Fit 3.0
Micro-Fit BMI
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Micro-Fit CPI
Micro-Fit RMF
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Applications
This is not a definitive list of applications for this product. It represents some of the more common uses. |
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