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Molex C-Grid III Interconnects

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Molex 2.54mm pitch C-Grid III interconnect system

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Molex's C-Grid III interconnect system is a 3rd generation range of 2.54mm pitch headers and receptacles, offering unique design features. This interconnect system offers complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect system is based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. This interconnected systems is fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

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Features/Applications

Table

Features	Applications
2.54mm (0.100") pitch, mates with 0.64mm (0.025") square pins Wire-to-board and board-to-board modular interconnect system Single and dual row options available North/south orientation allows ease of mating Halogen-free and glow wire compliant version available Header: Easy breakaway feature to produce smaller sizes for design flexibility and quick turnaround Shrouded header comes with polarisation and friction lock feature Contact and plating orientation according to DIN 41651 Gold flash and two-sided gold plating on contact available High pin retention force High mechanical stability soldering Receptacle: Stackable end-to-end Contact and plating orientation according to DIN 41651 Meets HE-13/14 specification	Commercial vehicle Air bag sensors Sound systems Steering controls Consumer Copiers Fax machines Printers

Features

Applications

2.54mm (0.100") pitch, mates with 0.64mm (0.025") square pins
Wire-to-board and board-to-board modular interconnect system
Single and dual row options available
North/south orientation allows ease of mating
Halogen-free and glow wire compliant version available
Header:
- Easy breakaway feature to produce smaller sizes for design flexibility and quick turnaround
- Shrouded header comes with polarisation and friction lock feature
- Contact and plating orientation according to DIN 41651
- Gold flash and two-sided gold plating on contact available
- High pin retention force
- High mechanical stability soldering
Receptacle:
- Stackable end-to-end
- Contact and plating orientation according to DIN 41651
- Meets HE-13/14 specification