Molex 2.54mm pitch C-Grid III interconnect system

Molex's C-Grid III interconnect system is a 3rd generation range of 2.54mm pitch headers and receptacles, offering unique design features. This interconnect system offers complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect system is based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. This interconnected systems is fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.