High-speed interconnect solutions to meet next-generation demands
Molex’s broad portfolio of next-generation connectivity solutions leverage the latest advancements to deliver high signal integrity, lower latency and reduced insertion loss for optimal efficiency, speed, and density.
Providing a solution for the fastest networks across telecommunications, networking and data center applications, Molex’s high-speed products support a wide range of data rates with connectors in various shapes, sizes and orientations.
Molex and Avnet Abacus technical specialists work closely to provide you with the highest level of support for your design and advise you on the optimal solution for volume production. Contact us at www.avnet-abacus.eu/ask-an-expert.
Featured products
Molex
BiPass I/O high-speed solutions
High-Speed I/O solutions with low-insertion-loss copper twinax cables that enable efficient and reliable implementation of 56 and 112 Gbps PAM-4 protocols.

Molex
1.00mm mezzanine IEEE 1386
The IEEE 1386 standard contains the details for adding standardised PCI Mezzanine Cards (PMC) to VMEbus and multibus host boards.

Molex
iPass interconnect solutions
iPass interconnect solutions provide host board and backplane connectors, as well as cable assemblies for SAS, PCIe, Ethernet, InfiniBand and fibre channel internal and external systems.

Molex
SFP+ and SFP interconnect system
High speed SFP+ and SFP products ensure industry-wide compatibility and supporting 2.5Gbps to 10Gbps data rates for gigabit Ethernet and fibre channel applications.

Molex
Mirror Mezz connectors
Footprint-compatible hermaphroditic Mirror Mezz connectors lower application costs with stackable mating to support data speeds up to 56Gbps per differential pair for telecommunications, networking and other applications.

Molex
Standard and custom RF connectors
Molex’s complete RF solutions, manufactured to industry-leading standards, for high-frequency and superior signal integrity in any environment.

Molex
Impel and Impel Plus custom backplane cable assemblies
Impel and Impel Plus Custom Cable Assemblies deliver next-generation data rates with industry-leading signal integrity and density in a complete backplane solution

Molex
SEARAY and SEARAY slim mezzanine family
Low-profile SEARAY mezzanine connectors and jumpers deliver a 12.5+ Gbps data rate, small footprint and robust solder-charge termination.

Molex
zSFP+ interconnect system
The zSFP+ interconnect system for 56Gbps serial channels, delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and fibre channel applications.

Molex
SlimStack board-to-board connectors
Molex SlimStack board-to-board connectors are available in a variety of pitch sizes, mated heights and circuit sizes for compact applications.

Molex
zQSFP+ and QSFP+ integrated product solutions
zQSFP+ and QSFP+ interconnect systems support Ethernet, fibre channel, SAS and InfiniBand Enhanced Data Rate (EDR) applications.

Molex
QSFP-DD interconnect system and cable assemblies
The QSFP-DD interconnect system’s 8-lane electrical interface transmits up to 28Gbps NRZ or 56Gbps PAM-4, up to 200Gpbs or 400Gbps aggregate, with the same module form factor as QSFP interconnects, making them backward compatible.

Molex
Modular jacks
Molex modular jacks are thoroughly tested for quality and reliability. Streamlined production processes mean cost effective solutions are available across a broad range of data speeds.


Molex | Optimising signal integrity in high speed industrial, automotive and healthcare applications
Learn how to navigate the challenges of signal integrity that must be factored in and mitigated against when it comes to integrating high speed networking into your applications in this webinar with Molex.
Tool
Future-proofing data centers simply solved by Molex
Explore the Molex virtual data center and experience their solutions for yourself.

Brochure
Molex solutions for 112Gbps architecture
Discover Molex’s full portfolio of scalable solutions with next-generation speed, signal integrity, EMI containment and thermal efficiencies.

Engineering Services
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