Tflex™ SF7 and SF4 silicone-free gap fillers

Tflex™ SF7 and Tflex™ SF4 are innovative entries in Laird’s growing portfolio of non-silicone gap filler materials. 

Both are high-performance thermal transfer solutions exhibiting excellent deflection properties, providing minimal pressure on components during deflection and thus minimizing board and component stress. Very little pressure is required to reach the lowest possible thermal resistance.

Tflex™ SF7, with its impressive 7.8Wm/K thermal conductivity and exceptionally low 0.057 thermal resistance (°C in 2/w), becomes a preferred choice of designers in the data center systems, optical module, automotive electronics, and camera design markets, along with the telecom, military, and aerospace industries.

Joining it is Tflex™ SF4 which serves the same industries by offering 4W/mK thermal conductivity and low 0.07 thermal resistance (°C in 2/w). 
Similar to the related gap filler material, Tflex™ SF4’s non-silicone formulation offers low peak and residual pressure capabilities and features excellent surface wetting for low contact resistance.