Laird’s soft SMD (Surface Mount Device) grounding contacts are packaged with tape-and-reel, the same method of other components applied in surface mount technology. All contacts are solder reflow compatible and designed to be suitable for automatic processing. They offer low weight, a high compression range, and are suitable for automatic SMD processing.
Soft HB-SMD foam contacts consist of a tin/copper PI film over polyurethane foam with a rectangular shape (SLG series) or an hourglass shape (SLH series).
Soft HT-SMD foam contacts consist of a tin/copper PI film over silicone foam. Laird’s SLM series is a standard type with a rectangular shape. The SSM series resembles the SLM series but with lower compression force. The SLN series has an hourglass shape or can come in a user-defined customized shape.
Laird’s soft HT-SMD foam contacts of a tin/copper PI film over silicone foam. SLM series is standard type with a rectangular shape. The SSM series resembles the SLM series but with lower compression force. The SLN series has an hourglass shape or can have a user-defined customized shape.
Soft HB-SMD foam contacts consist of a tin/copper PI Film over polyurethane foam and can come in a rectangular shape (SLG series) or an hourglass shape (SLH series).
Laird’s HT-SMD SLM/SSM/SLN soft SMD contacts consist of a tin/copper PI film over silicone foam. The SLM series is a standard type with a rectangular shape. The SSM series resembles the SLM series but features lower compression force. The SLN series can have an hourglass shape or a user-defined customized shape.
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