KEMET KC-LINK™ SMD MLCCs with KONNEKT™ technology

KEMET's KC-LINK™ with KONNEKT™ technology surface mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT high density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multi-chip solution for high density packaging. By utilizing KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.

KONNEKT technology enables a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature. With an operating temperature range up to 150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications, which require minimal cooling. KC-LINK with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.

These capacitors can also be mounted in a low-loss orientation to further increase power handling capability. The low-loss orientation lowers ESR (Effective Series Resistance) and ESL (Effective Series Inductance) which increases ripple current handling capability.

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Features/Applications

Features Applications
  • Extremely high-power density and ripple current capability
  • Extremely low equivalent series resistance (ESR)
  • Extremely low equivalent series inductance (ESL)
  • Low-loss orientation option for higher current handling capability
  • Capacitance offerings ranging from 14 – 880 nF
  • DC voltage ratings from 500 – 2,000 V
  • Operating temperature range of −55°C to +150°C
  • No capacitance shift with voltage
  • No piezoelectric noise
  • High thermal stability
  • Surface mountable using standard MLCC reflow profiles
  • Wide bandgap (WBG), silicon carbide (SiC) and gallium nitride (GaN) systems
  • Data centers
  • EV/HEV (drive systems, charging)
  • LLC resonant converters
  • Switched tank converters
  • Wireless charging systems
  • Photovoltaic systems
  • Power converters
  • Inverters
  • DC link
  • Snubber

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