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DF63 high powered wire-to-board connectors

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DF63 Series, 3.96 mm Pitch, 15 A High Current, Wire-to-Board Connector 

The DF63 connector range consists of cable mount, female crimp sockets and board mount, vertical and right angle male headers that can handle up to 15 A max current rating. Waterproof and non-waterproof in-line versions have been added to the range (DF63W waterproof). The overall size has been designed with space saving in mind. The three position header for example, only occupies 88 mm² approximate board space due to the small pitch. 

 Secure locking is guaranteed by the robust lock that gives a clear tactile click when mated. This confirms the connector is fully engaged guaranteeing complete electrical and mechanical connection. The lock is on the centre of the housing to avoid uneven locking and cable entanglement which is common with side locks. Furthermore, multiple connectors can be mounted closer together side by side. 

Hirose Electric has introduced the DF63 series to meet the increased requirement for small, high powered wire-to-board connectors offering advanced reliability for industrial equipment.

Long Copy

The header features square male pin contacts that have a wide conductive surface area (1.14 mm each side) to carry the high current. Each contact is protected by housing walls to prevent them from short circuits and being touched.  

The cable mount female socket housing utilises crimp contacts that have a unique internal multi-point contact structure to ensure good contact wipe and high contact reliability. The design of the housing base is tapered to allow resin sealing up to 5 mm high. The resin stopper, which is a step underneath the lock, stops the resin rising too far. Keying variations are available to prevent incorrect insertion when multiple connectors are used. 

DF63 series is part of the EnerBee product family. The EnerBee family features Wire-to-Board and Wire-to-Wire power connectors to provide technically advanced connectivity solutions for industrial power sources.  