Max clip™ system

The BOYD Max Clip™ System is a high performance, low cost thermal solution for discrete power semiconductors. The system eliminates the need for mounting holes, screws or rivets while optimizing the contact and thermal efficiency of the heat sink. Max Clips™ are quick, robust attachments that save on labor and hardware costs and increase performance and design flexibility.

Max Clips apply consistent, uniform pressure at the center of the semiconductor- improving contact with the heat sink for better thermal performance and maximum component reliability. With conventional nuts, bolts, and rivets mounting force is set at the time of assembly and can lessen over the product’s service life with changes in interface material thickness. Nuts and bolts also impart force at one end of the package creating uneven pressure over the length of the device, actually creating thermal inefficiency. Max Clips maintain constant assembly force even as interface material deteriorates or shifts over time.

Aavid offers approximately 50 standard extrusion profiles that can be used with over 20 different Max Clips to suit your application. The Max Clip System™ is designed to accommodate a variety of semiconductor packages including TO-220, TO-218, TO-247, TO-3P, and packages without mounting holes like TO-262, TO-273, TO-274, and TO-251.