BarKlip® BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
The cable connects with a system rack bar and a 3.00mm thick copper bar, to achieve a direct pluggable connection to an un-insulated busbar. This connection generates very low energy loss, with a maximum resistance of only 0.2mΩ per port.
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