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POWERING YOUR NEXT DESIGN

Explore Nexperia MOSFETs, SiC and
GaN solutions with tools and design resources.

THE TECHNOLOGY ADDICTS

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FOR SMARTER DESIGNS

Discover Renesas connectivity solutions
designed for intelligent, connected systems.

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WE SENSE WHAT MATTERS

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analog/mixed-signal sensor portfolio.

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TDK-HF-Series-EN-Image

TDK

ModCap HF is a high-frequency DC-link capacitor with low ESR, low inductance and long lifetime.

Broadcom AFBR-S50LX85D Sensor Module product image

AFBR-S50LX85D Sensor Module

Broadcom

50 m, Time of Flight, 4.5 to 5.5 VDC, solder

onsemi SmartENC Evaluation Kit

SmartENC Evaluation Kit

onsemi

Kickstart your motor control project with the onsemi SmartENC ev-kit!

TDK-B25648A-Series-EN-Image

ModCap DC-Link film capacitors

TDK

Designed for high‑current, high‑temperature DC-link stages in power converters.

Nexperia 1200V SiC MOSFET in QDPAK product image

1200V SiC MOSFET in QDPAK

Nexperia

QDPAK: high thermal performance, compact size, easy assembly for high-power use

STMicroelectronics ST87M01 industrial module

STMicroelectronics

Ultra-compact, low-power NB-IoT industrial module series with optional GNSS

TE Connectivity Potter and Brumfield relays

Potter & Brumfield relays

TE Connectivity

Solid state relays-SSRs are designed for industrial application.

ams OSRAM SYNIOS™ E0808 product image

SYNIOS™ E0808

ams OSRAM

Wide Lambertian Radiation in new compact package

Renesas RA6W1 - front side of the chip

Renesas

Highly integrated ultra-low power dual-band Wi-Fi 6 Arm Cortex-M33 MCU

KYOCERA-AVX-P822603-Series-EN-Image

P822603 Universal Broadband Embedded LTE/LPWA antenna

KYOCERA AVX

P822603 LTE/LPWA antenna with IMD technology offering reliable performance and corner placement.

Infineon PSOC™ Edge E84 Microcontrollers product image

PSOC™ Edge E84 Microcontrollers

Infineon

High performance, low-power, and robust security to on-device AI, responsive ML at the edge

Product sample of Nordic Semiconductor nRF93M1 modem

Nordic Semiconductor

Low Power, Easy to Use Cat 1 bis Modules

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TE Connectivity I From Furrow to Cloud

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