Over the past few years, a revolution has occurred in the space market. New companies are entering this market with plans for low earth orbit constellations offering world wide internet, earth observation or private networks. They want the benefits of lower cost Commercial Off The Shelf (COTs) components combined with a degree of radiation tolerance. Avnet Silica is working with their semiconductor partners to support this dynamic new market area. These suppliers are using their vast knowledge and long experience of supporting traditional radiation-hardened components to come up with innovative, lower cost, reliable radiation tolerant components.
Avnet Silica’s European team of aerospace experts are ready to support you on your space 2.0 design.
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Putting Power First
From a technology perspective, we have come a long way since the first lunar missions. Space is being commercialised in ways the pioneers could have only imagined. There are now almost 10,000 satellites in orbit around Earth. Tourism may be the next frontier.
The demand for more processing capability on the edge of space is pushing the limits of power design. Making power supplies radiation-tolerant and more efficient will help keep the satellite industry launching.
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Addressing the processing needs of Space 2.0 applications
The heavens may be infinite, but in Earth’s neighbourhood things are getting crowded. Space 2.0, a new era of exploration and development driven more by commercial interests than government action, is fuelling rapid innovation in reusable rockets, satellite internet connectivity, Earth observation platforms, navigation, space tourism and many more applications. As a result, our skies are rapidly becoming much busier than ever before.
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FPGAs fit for space
The arrival of Space 2.0 has democratised the use of satellites and opened up an array of applications that can be serviced by electronics in low-Earth orbit (LEO) as well as those on higher trajectories such as geosynchronous equatorial orbit (GEO). Although launch costs have fallen rapidly, development cost and time present their own challenges. Even if deployed in large constellations of several hundred satellites like some of the LEO communications networks now orbiting, space electronics designs are intrinsically low-volume applications.
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Radiation-hardened processors for space
Lower launch costs have helped open up a raft of applications for satellites that, by featuring advanced sensors and computing, are able to deliver novel communications and remote-monitoring services. Limited communication bandwidth to ground stations and the increasing resolution of sensors mean that sophisticated compression and onboard analysis techniques are mandated.
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Overcoming the radiation challenges of space electronics
To deploy systems into orbit that will be reliable requires a focus on radiation hardening of electronics during the design process. Radiation represents the biggest reliability challenge for electronic hardware in space and the small satellites in low-Earth orbits (LEOs) can be particularly under threat. The radiation environment close to Earth is divided into two main categories.
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Versal for Space
Versal is a family of adaptive compute acceleration platforms (ACAPs) designed for a wide range of applications, including data centers, networking, automotive, and aerospace.
Some aspects that make Versal devices suitable for space applications include:
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Adaptability: Versal devices are known for their adaptability, featuring programmable logic, processors, and AI engines. This adaptability allows developers to tailor the hardware to specific requirements, making them suitable for diverse space applications with varying computational needs.
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High-Performance Processing: Versal devices incorporate advanced processing elements, including high-performance ARM Cortex processors, FPGA fabric, and AI engines. These features enable efficient and high-performance processing, which can be crucial in space applications where computational power is often limited.
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Integration of Various Functions: ACAPs like Versal integrate various functions into a single chip, reducing the need for multiple discrete components. This integration can result in a more compact and power-efficient solution, which is advantageous in space applications where size, weight, and power constraints are critical.
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Radiation Hardening: Space environments expose electronic components to increased levels of radiation. Electronic devices used in space need to be designed or tested for radiation hardness to ensure reliable operation. It's possible that Versal devices or associated technologies include features to address these challenges.
Avnet Silica's Ecosystem for AMD Versal for Space
| Requirements | Supplier |
|---|---|
| SRAM | Microchip / GSI Technology |
| NVM | Microchip / Mercury |
| DDR4 | Teledyne e2v / Mercury |
| MCU | Microchip / Teledyne e2v |
| Power Solutions | Renesas Intersil |
| High Speed ADC / DAC | Teledyne e2v |
| Space XO | Microchip / Vectron |
| Ruggedised TCXO | SiTime |
AMD
The AMD Versal range offers high-performance CPUs, GPUs, and accelerators, integrating advanced technologies for diverse workloads in AI, HPC, and data analytics, promising efficient and scalable solutions.
SiTime
Tough environmental conditions such as extreme temperatures and vibration make selecting a stable clock a real challenge. Designers of mission critical systems can depend on SiTime commercial ruggedized timing for predicable performance.
GSI Technology
GSI Technology’s Aerospace and Military focus supports applications for LEO and GEO orbits, high altitude, terrestrial military products, and multi-sensor (data fusion) processing applications.
Teledyne e2v
The space-grade digital and mixed signal devices developed by Teledyne e2v offer an optimal balance of performance, reliability and cost effectiveness. See space radiation tolerent 4GB/8GB DDR4 and data converters up to ka-band.
Microchip
See overview of Microchips Aerospace portfolio and take a closer look at memory, microcontroller, microprocessor and oscillator products.
Renesas Intersil
Renesas's history and experience in the space industry spans decades, beginning with the founding of Radiation, Inc. in 1950. Renesas leverages this experience to deliver efficient, thermally optimized, and reliable products
| Image | Product | New |
|---|---|---|
 | Teledyne e2v DDR4 The 4/8GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications. The advanced DDR4 memory optimized for space applications delivers superior performance while | |
 | Microchip SAMD21RT Designed for space-constrained applications where size and weight are of critical importance, the SAMD21RT is available in a small footprint of 10 mm × 10 mm. Running at up to 48 MHz, the SAMD21RT delivers high-performance processing for harsh enviro | |
 | Microchip Radiation-Tolerant Isolated DC-DC Converters The Low Earth Orbit (LEO) market is rapidly growing as private and public entities explore New Space; the exploration of New Space requires everything from 5G communication and cube satellites to IoT applications. There is an increased demand for sta | |
 | Microchip Ka-band Monolithic Microwave Integrated Circuit (MMIC) Satellite communication systems use complex modulation schemes to achieve the blazingly fast data rates required to deliver video and broadband data. To attain this, they must deliver high RF output power while simultaneously ensuring the signals ret | |
 | Microchip RT4G150 RTG4 FPGAs integrate Microchip's fourth-generation flash-based FPGA fabric and high-performance interfaces such as serialization/deserialization (SERDES) on a single chip while maintaining the resistance to radiation-induced configuration upsets in t | |
 | Microchip Space System Managers The Space System Manager (SSM) is a special purpose analog mixed signal IC that integrates mixed signal functions commonly used in satellite systems. The SSM IC can interface with radiation tolerant FPGAs such as those offered in Microsemi’s portfol | |
 | Microchip PolarFire® SoC Icicle Kit The PolarFire SoC Icicle kit is a low-cost and low power development platform that enables evaluation of the five-core Linux® capable RISC-V microprocessor subsystem, innovative Linux and real-time execution, low-power capabilities and the rich set o | |
 | Microchip All-in-One Hybrid Power Drive Module Aircraft manufacturers designing More Electric Aircraft (MEA) are looking to convert the flight control systems from hydraulic to electric to reduce weight and design complexities. To meet the needs for an integrated and configurable power solution f |
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