Microchip All-in-One Hybrid Power Drive Module
The highly integrated and configurable three-phase power module is the first variant of the new family and can be customized using silicon carbide or silicon, reducing power solution size and weight for electric aircraft
Aircraft manufacturers designing More Electric Aircraft (MEA) are looking to convert the flight control systems from hydraulic to electric to reduce weight and design complexities. To meet the needs for an integrated and configurable power solution for aviation applications, Microchip introduced a new comprehensive hybrid power drive module, the first variant introduced in the new product line of power devices that will be available in 12 different variants with either silicon carbide (SiC) MOSFETs or insulated-gate bipolar transistors (IGBTs).
These hybrid power drive modules are highly integrated power semiconductor devices that reduce the number of components and simplify the overall system design. The configurable power devices include a three-bridge topology that are available in SiC or Si semiconductor technologies. Offering a compact design and low weight and profile, these high-reliability power devices help reduce the size and weight of MEAs.
Other key capabilities of these hybrid power drive modules include numerous auxiliary power devices that facilitate an inrush current limit function. Optional add-on capabilities include soft start, solenoid interface drive, regenerative brake switch and thermal sensors for external monitoring circuitry usage. The power modules also facilitate high-switching frequency power generation, which enables smaller and more efficient systems.
The standard voltage of the power modules ranges from 650V to 1200V, with the option to customize up to 1700V on request. The device is designed for low inductances for high-power density with power and signal connectors that are solderable directly on the user’s printed circuit board.
The hybrid power drive modules deliver a comprehensive power solution for our customers who are designing More Electric Aircraft.
Benefits
- High-performance SiC technology enables higher power density and lower switching losses
- Stable temperature behavior for reliable operation
- Environmentally friendly and mechanically robust packaging
- Solderable terminals for easy PCB mounting
- High thermal conductivity and low junction-to-case thermal resistance with direct heatsink mounting to reduce cooling requirements
Applications
- HPD for Electromechanical Actuator (EMA) and Electrohydrostatic Actuator (EHA) systems
- High-reliability Power Core Module (PCM)
- Modular power module for Power Drive Electronics (PDEs)
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