NXP i.MX 952
i.MX 952 - Applications Processor: High-Performance AI Vision Processing
The i.MX 952 applications processor is designed for AI-powered sensor fusion and vision sensing applications, supported by the integrated eIQ® Neutron Neural Processing Unit (NPU). It features advanced graphics and video cores, powerful vision and machine learning (ML) acceleration and efficient CPU performance with real-time processing. Part of the EdgeVerse™ portfolio of intelligent edge solutions, it offers advanced security with integrated EdgeLock® secure enclave to support energy-efficient edge computing. It is well-suited for automotive, industrial and commercial IoT applications.
Features
- Multicore processing
- 4x Arm® Cortex®-A55
- 1x Arm Cortex-M7
- 1x Arm Cortex-M33
- NXP eIQ NPU
- Memory
- Up to 6000 Megatransfers per second (MT/s) x32 Low-Power Double Data Rate 5 (LPDDR5) or up to 4266 MT/s x32 Low-Power Double Data Rate 4X (LPDDR4X): Error-correcting code (ECC) and encryption
- 3x micro Secure Digital High Capacity (uSDHC): Secure digital 3.0 (SD3.0), Secure Digital Input/Output 3.0 (SDIO3.0) and embedded MultiMediaCard 5.1 (eMMC5.1)
- XSPI with in-place execute-on-DRAM (IPED), with support for serial peripheral interface (SPI) NOR and SPI NAND flash memories
- Connectivity
- 2x 1 Gbit/s Ethernet with time-sensitive networking (TSN); audio video bridging (AVB) and IEEE 1588 for sync; energy-efficient ethernet (EEE)
- 1x Peripheral Component Interconnect express (PCIe) Gen 3.0 (1-lane); 2x USB2.0 with physical layer (PHY)
- 2x 32-pin flexible input/output (FLEXIO) interface (bus or serial I/O)
- 8x universal asynchronous receiver/transmitter (UART); 8x low-power serial peripheral interface (LPSPI); 8x Low-Power Inter-Integrated Circuit (LPI2C); 2x improved inter-integrated circuit (13C); 3x controller area network flexible data-rate (CAN-FD)
- Packaging
- 19x19mm flip-chip ball grid array (FCBGA), 0.7 mm pitch; and 15x15mm, hybrid pitch
- 19x19mm flip-chip ball grid array (FCBGA), 0.7 mm pitch; and 15x15mm, hybrid pitch
- Temperature Range
- Automotive -40 °C ambient temperature (Ta) to 125 °C junction temperature (jt)
- Extended Industrial -40 °C Ta to 125 °C Tj
- Industrial -40 °C Ta to 105 °C Tj
- Commercial 0 °C Ta to 90 °C Tj
- General
- Functional Safety: IEC61508 (SIL 2) for Industrial and ISO26262 (ASIL B) for Automotive
- Security: EdgeLock Secure Enclave (Advanced Profile); EdgeLock Prime Accelerator; Post Quantum Cryptography (PQC)
- Graphics
- 3D GPU: OpenGL® ES 3.2, Vulkan® 1.2, OpenCL™ 3.0
- 2D GPU
- Video
- Video Decode: 4k30, h.265/4
- Video Encode: 4k30 h.264
- Display Interfaces
- 350 MHz MIPI-DSI (4-lane, 2.5 Gbit/s/lane) supporting 4kp30 or 3840x1440p60
- Up to 1080p60 LVDS Tx (2x 4-lane or 1x 8-lane)
- Camera Interfaces
- MIPI-CSI and ISP (1x 4-lane or 2x 2-lane, 2.5 Gbit/s/lane) with PHY
- Up to 1x4Kp60fps, 2x4Kp30, 4x1080p60 cameras with MIPI virtual channels
- Audio
- 17x I²S TDM (32-bit @ 768 kHz)
- 8 channel PDM microphone input
- MQS: Medium Quality Sound output (sigma-delta modulator)
Applications
- Automotive
- Driver Monitoring Systems (DMS) and Occupant Monitoring Systems
- In-Cabin Sensing System
- Two-Wheeler Digital Connected Cluster
Block diagram
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