NXP i.MX 937
i.MX 937 - Applications Processor: Secure, Smart, Power‑ and Cost‑Efficient, Scalable Edge AI Processing
Scalable Edge AI and HMI Processing for Industrial and IoT Designs
The i.MX 937 processor delivers a balanced combination of edge AI acceleration, multimedia performance, and secure scalability, enabling cost-efficient designs for industrial, automotive, and IoT applications.
Features
- Multicore Processing
- 4x Arm® Cortex®-A55
- 1x Arm Cortex-M7
- 1x Arm Cortex-M33
- NXP eIQ® Neutron NPU
- Memory
- Up to 4500 megatransfers per second (MT/s) x32/x16 Low-Power Double Data Rate 5 (LPDDR5) or up to 3733 MT/s x32/x16 Low-Power Double Data Rate 4x (LPDDR4x); With inline error correcting code (ECC) and encryption
- 3x ultra-Secure Digital Host Controller (uSDHC): Secure Digital (SD) 3.0; Secure Digital Input/Output (SDIO) 3.0, embedded MultiMediaCard 5.1 (eMMC5.1)
- eXtended Serial Peripheral Interface (XSPI) with Integrated Physical layer Encryption and Decryption (IPED), with support for Serial Peripheral Interface (SPI) NOR and SPI NAND memories
- Graphics
- 3D GPU: OpenGL® ES 3.2, Vulkan® 1.2, OpenCL™ 3.0
- 2D GPU
- Video
- Video Decode: 1080p60, h.265/4
- Video Encode: 1080p60 h.264
- JPEG Encoder/Decoder
- Display Interfaces
- MIPI-DSI
- Up to 1080p60 LVDS Tx (2x 4-lane or 1x 8-lane)
- Camera Interfaces
- MIPI-CSI with PHY
- MIPI-CSI with PHY
- Audio
- 17x I²S TDM (32-bit @ 768 kHz)
- 8 channel PDM microphone input
- MQS: Medium Quality Sound output (sigma-delta modulator)
- Connectivity
- 2x 1 GB/s Ethernet with time-sensitive networking (TSN), audio-video bridging (AVB) and IEEE 1588 for synchronization, plus energy-efficient Ethernet (EEE)
- 1x PCI Express (PCIe) Gen 3.0 (1 lane) and 2x USB 2.0 with integrated PHY
- 2x 32 pin FlexIO interfaces (bus or serial I/O)
- 8x universal asynchronous receiver/transmitter(UART), 8x low-power serial peripheral interface (LPSPI), 8x low-power inter integrated circuit (LPI2C) and 3x controller area network flexible data rate (CAN FD)
- Packaging
- 19 x 19 mm, flip chip ball grid array (FCBGA), 0.7 mm pitch, and 15 x 15 mm, FCBGA, 0.5 mm pitch
- 19 x 19 mm, flip chip ball grid array (FCBGA), 0.7 mm pitch, and 15 x 15 mm, FCBGA, 0.5 mm pitch
- Temperature Range
- Automotive: 40 °C Ta to 125 °C Tj
- Extended industrial: 40 °C Ta to 125 °C Tj
- Industrial: 40 °C Ta to 105 °C Tj
- Commercial: 0 °C Ta to 90 °C Tj
- Security
- EdgeLock® Secure Enclave (Advanced Profile), EdgeLock Prime Accelerator and post quantum cryptography (PQC)
Applications
- Automotive
- Standalone clusters
- Secondary displays and two-wheeler digital connected clusters
- Industrial
- Building automation systems
- Controllers
- Factory automation equipment
- IoT
- Home controllers
- Smart Appliances
- Conferencing Systems
- Printers and Scanners
Block diagram
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