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NXP i.MX 937

i.MX 937 - Applications Processor: Secure, Smart, Power‑ and Cost‑Efficient, Scalable Edge AI Processing

Top view of NXP i.MX 937 Applications Processor

Scalable Edge AI and HMI Processing for Industrial and IoT Designs

The i.MX 937 processor delivers a balanced combination of edge AI acceleration, multimedia performance, and secure scalability, enabling cost-efficient designs for industrial, automotive, and IoT applications.

 

Features

  • Multicore Processing
    • 4x Arm® Cortex®-A55
    • 1x Arm Cortex-M7
    • 1x Arm Cortex-M33
    • NXP eIQ® Neutron NPU
       
  • Memory
    • Up to 4500 megatransfers per second (MT/s) x32/x16 Low-Power Double Data Rate 5 (LPDDR5) or up to 3733 MT/s x32/x16 Low-Power Double Data Rate 4x (LPDDR4x); With inline error correcting code (ECC) and encryption
    • 3x ultra-Secure Digital Host Controller (uSDHC): Secure Digital (SD) 3.0; Secure Digital Input/Output (SDIO) 3.0, embedded MultiMediaCard 5.1 (eMMC5.1)
    • eXtended Serial Peripheral Interface (XSPI) with Integrated Physical layer Encryption and Decryption (IPED), with support for Serial Peripheral Interface (SPI) NOR and SPI NAND memories
       
  • Graphics
    • 3D GPU: OpenGL® ES 3.2, Vulkan® 1.2, OpenCL™ 3.0
    • 2D GPU
       
  • Video
    • Video Decode: 1080p60, h.265/4
    • Video Encode: 1080p60 h.264
    • JPEG Encoder/Decoder
       
  • Display Interfaces
    • MIPI-DSI
    • Up to 1080p60 LVDS Tx (2x 4-lane or 1x 8-lane)
       
  • Camera Interfaces
    • MIPI-CSI with PHY
       
  • Audio
    • 17x I²S TDM (32-bit @ 768 kHz)
    • 8 channel PDM microphone input
    • MQS: Medium Quality Sound output (sigma-delta modulator)
       
  • Connectivity
    • 2x 1 GB/s Ethernet with time-sensitive networking (TSN), audio-video bridging (AVB) and IEEE 1588 for synchronization, plus energy-efficient Ethernet (EEE)
    • 1x PCI Express (PCIe) Gen 3.0 (1 lane) and 2x USB 2.0 with integrated PHY
    • 2x 32 pin FlexIO interfaces (bus or serial I/O)
    • 8x universal asynchronous receiver/transmitter(UART), 8x low-power serial peripheral interface (LPSPI), 8x low-power inter integrated circuit (LPI2C) and 3x controller area network flexible data rate (CAN FD)
       
  • Packaging
    • 19 x 19 mm, flip chip ball grid array (FCBGA), 0.7 mm pitch, and 15 x 15 mm, FCBGA, 0.5 mm pitch
       
  • Temperature Range
    • Automotive:  40 °C Ta to 125 °C Tj
    • Extended industrial:  40 °C Ta to 125 °C Tj
    • Industrial:  40 °C Ta to 105 °C Tj
    • Commercial: 0 °C Ta to 90 °C Tj
       
  • Security
    • EdgeLock® Secure Enclave (Advanced Profile), EdgeLock Prime Accelerator and post quantum cryptography (PQC)

 

Applications

  • Automotive
    • Standalone clusters
    • Secondary displays and two-wheeler digital connected clusters
       
  • Industrial
    • Building automation systems
    • Controllers
    • Factory automation equipment
  • IoT
    • Home controllers
    • Smart Appliances
    • Conferencing Systems
    • Printers and Scanners

 

Block diagram

NXP i.MX 937 block diagram
Click to enlarge

 

 

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