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STMicroelectronics LDLN015
The LDLN015 is an ultra low noise linear regulator which provides 150 mA maximum current from an input voltage ranging from 2.1 V to 5.5 V with a typical dropout voltage of 86 mV. With its 6.3 µ VRMS noise value in a band from 10 Hz to 100 kHz, the L |
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STMicroelectronics STTS22H
The STTS22H is an ultra-low-power, high-accuracy, digital temperature sensor offering high performance over the entire operating temperature range. The STTS22H is a band gap temperature sensor coupled with an A/D converter, signal processing logic an |
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onsemi isolated gate driver NCD57080
NCD57080A, NCD57080B and NCD57080C are high−current single channel IGBT gate drivers with 3.75 kVrms internal galvanic isolation, designed for high system efficiency and reliability in high power applications. The devices accept complementary inputs |
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Infineon Technologies OptiMOS™ 5 power MOSFETs
The new Infineon is expanding the OptiMOS™ 5 power MOSFETs portfolio in 150 V with the TO-Leadless package. The TOLL package is enabling high current design, higher power density and lower EMI. Thanks to its features it is the perfect fit for applica |
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Infineon Technologies SEMPER™ NOR Flash
SEMPER™ NOR Flash memory provides the high-performance and critical safety features needed for automotive, industrial, and communications applications. It is architected and designed for functional safety, making it the industry’s first ASIL-B-compli |
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Infineon Technologies PSOC® 62 - Arm® Cortex®-M4/M0+
PSOC® 62 CY8C62x4 performance line, built on an ultra low-power 40-nm platform, is a combination of Arm® Cortex™-M4 and Arm Cortex-M0+ CPUs, with low-power flash technology, CapSense® capacitive sensing, high-performance and low-power analog peripher |
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Infineon Technologies 56Mbit & 512Mbit HYPERRAM™
HYPERRAM™ is a high-speed, low-pin-count, low-power self-refresh Dynamic RAM (DRAM) for high-performance embedded systems requiring expansion memory for scratchpad or buffering purposes. HYPERRAM™ 2.0 supports HYPERBUS™ and Octal xSPI interfaces tha |
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Infineon Technologies PSoC® 61 - Arm® Cortex®-M4
The PSoC 61 CY8C61x4 programmable line of microcontrollers, based on the PSoC 6 MCU platform, is a high-performance microcontroller based on Arm Cortex-M4 CPU, with low-power flash technology, CapSense® capacitive sensing, high-performance and low po |
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Infineon Technologies MOTIX™ 6EDL7141
The MOTIX™ 6EDL7141 is Infineon’s latest 3-phase motor control gate driver IC that enables the development of high-performance battery-operated products using BLDC or PMSM motors. Ideal applications include cordless power tools, gardening products, a |
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Infineon Technologies IMI111T - iMOTION™
iMOTION™ IPM integrating motor controller, three phase gate driver and 600V/2A and 600V/4A IGBTs in DSO-22 package. The IMI111T device does not require a heatsink and addresses motor drives with a fan application typical output power of 50 W / 70 W |
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Infineon Technologies 6ED2742S01Q
The MOTIX™ 6ED2742S01Q is a 160 V SOI based gate driver designed for three phase BLDC motor drive applications. Integrated bootstrap diodes are used to supply the three external high sides charging bootstrap capacitors and supports 100% duty cycle op |
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SG Micro SGM835
The SGM835 has a wide input common-mode voltage range from -0.3V to 72V, and is available with gains of 12.5V/V, 20V/V and 50V/V. The bandwidth of small-signal can reach up to 160kHz. The SGM835 is available in a Green MSOP-8 package. It is specifie |
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Ezurio (Laird) BT610 I/O sensor
Laird Connectivity’s Sentrius™ BT610 I/O Sensor with Bluetooth 5 turns your wired sensors into IP67-rated battery-operated wireless nodes, providing robust and secure messaging. Leveraging our BL654 module, it provides full Bluetooth 5 capabilities, |
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Power Integrations InnoSwitch™3-TN
The new InnoSwitch™3-TN family slashes Energy Waste in Appliance Power Supplies by 75%. It dramatically increases the efficiency of auxiliary power supplies used in appliances, consumer products and industrial applications. Power Integrations' InnoSw |
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Toshiba Electronics Europe TLX9188
The TLX9188 - a high voltage transistor output automotive photocoupler can be operated with a collector-emitter voltage (VCEO) of 200V (min.) - the highest ever produced by Toshiba in an automotive photocoupler and 2.5 times higher than the current d |
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Tria MSC CX-MB-IP1
The MSC CX-MB-IP1 is an ideal base board platform to integrate any COM Express compliant module in basic or compact format supporting Type 2 of the specification. Our industrial platform MSC CX-MB-IP1 offers a large variety of interfaces commonly us |
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Tria MSC C6C-EL
The Tria (formerly MSC) C6C-EL module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and g |
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Tria MSC C7B-DVL
The Tria (formerly MSC) C7B-DVL is equipped with Intel® C3000 series processors, offering broadest scalability from four to sixteen processor cores as well as low-cost entry-level models. The modules have up to five Ethernet interfaces, four of which |
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Tria MSC C6-MB-EVA
COM Express™, an open specification of the PICMG (PCI Industrial Computer Manufacturer Group), is a module concept to bring PCI Express and other high speed serial technologies like SATA, USB and digital display interfaces on a COM (Computer On Modul |
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Tria MSC C6B-CFLR
The Tria (formerly MSC) C6B-CFLR module is based on the 9th Generation Intel® Core™ Processor family. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. The new MSC C6B-CFLR |
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Tria MSC HCC-CFLS
The Tria (formerly MSC) HCC-CFLS module is the first member of the new COM-HPC product family. It enables a PICMG COM-HPC Client interface and features size C module format. The Client interface offers a wide range of I/O, including multiple graphics |
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Tria MSC Q7-AL
The new Tria (formerly MSC) Q7-AL module features Intel’s next-generation low-power System-on-Chip (SOC) for the Internet of Things. The Intel Atom Processor E3900 series integrates processor core, graphics, memory, and I/O interfaces into one soluti |
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Tria MSC C6B-CFLH
The Tria (formerly MSC) C6B-CFLH module is based on the 8th Generation Intel® Core™ Processor family. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. The new MSC C6B-CFLH |
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Tria MSC SM2S-ZUSP
The Tria (formerly MSC) SM2S-ZUSP module is based on Xilinx Zynq UltraScale+ MPSoC and supports ZU2, ZU3, ZU4 or ZU5 FPGA complexity. Zynq UltraScale+ MPSoC devices provide 64-bit processor scalability while combining real-time control with soft and |
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Tria MSC C6C-RYZ
The Tria (formerly MSC) C6C-RYZ module is the embedded platform for the AMD Ryzen™ Embedded V1000 and R1000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing |
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Tria MSC NANORISC-MB2
nanoRISC® is a module concept combining the latest low power RISC controllers and embedded interfaces on a small form factor COM (Computer On Module). Ideally suited for embedded applications, a variety of easy-to-use interfaces are available. The na |
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Tria MSC C10M-AL
The Tria (formerly MSC) C10M-AL module is based on Intel’s multi-core system-on-chip (SOC) Atom generation (codenamed “Apollo Lake”). It integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one solution. Manufact |
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Tria MSC C6C-AL
The Tria (formerly MSC) C6C-AL module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation (codenamed “Apollo Lake”) that integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one solution. Based on |
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Tria SM2S-AL
The new Tria (formerly MSC) SM2S-AL module features Intel’s next-generation low-power System-on-Chip (SOC) for the Internet of Things. The Intel Atom Processor E3900 series integrates processor core, graphics, memory, and I/O interfaces into one solu |
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Tria MSC Q7-EL
The new Tria (formerly MSC) Q7-EL module features Intel’s next-generation low-power, multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom proces |