New Product Introduction

Sandisk iNAND® IX EM122 Industrial

Embedded flash devices with proven reliabilty and endurance for Industrial and IoT at the edge

Sandisk iNAND®  IX EM122a Industrial

Sandisk iNAND IX EM122 EFDa Industrial embedded flash devices are designed and tested to withstand demanding environmental conditions, these industrial-grade flash devices feature advanced flash memory management firmware to provide enhanced  power immunity, ECC, wear leveling, and bad block management. Data intensive applications can rely on iNAND IX EM122 EFDa Industrial products to capture every critical moment, log each event, and to ensure quality-of-service to end-users.

The Smart Partitioning feature in the iNAND IX EM122 EFDa Industrial flash devices allows Boot  partitions, RPMB, multiple General Purpose Partitions, User Data Area and Enhanced User Data Area, providing OEMs the flexibility to choose different attributes on a single device depending on storage requirements.

Product Highlights

  • Operating Temp Range: –40°C to 85°C on Industrial Extended - Temperature SKUs; –25°C to 85°C on Commercial and Industrial SKUs
  • Broad portfolio: 8GB to 64GB MLC based eMMC
  • Extended product life cycle for industrial-grade applications
  • Advanced controller built for endurance and reliability
  • High endurance: up to 3K P/E cycles in MLC
  • Smart Partitioning, Advanced Health Report and Manual Refresh (Industrial Grade)
  • Enhanced User Data Area (EUDA) 
  • Operating voltage: 2.7V to 3.6V

Benefits

  • Drives faster time to market with quick system integration
  • Enables real-time analytics at the edge
  • Enables cloud augmentation, reduces network traffic
  • Improves connected user experience
  • Provides reliable local storage, as primary or backup
  • Optimizes system performance

Industrial application 

  • Industrial boards and PCs
  • Factory automation
  • Medical
  • Smart meters/utilities
  • Smart buildings/homes
  • IoT gateways
  • Surveillance
  • Drones
  • SOM
  • Transportation
  • Networking

 

 

 

 

 

 

 

 

 

 

 

Specifications

Capacity 8 GB to 64GB
Interface  e.MMC 5.1 HS400
NAND Technology  X2 MLC
Opening Voltage  Core voltage (VCC): 2.7–3.6V; I/O (VCCQ ) voltage: 1.7–1.95V or 2.7–3.6V
Opening Temperature  -25°C to 85°C
Packing Size  11.5x13x0.8mm

 

Product Numbers

-25°C to 85°C, 8 GB, 2D NAND SDINBDG4-8G-I2
-40°C to 85°C, 8 GB, 2D NAND SDINBDG4-8G-XI2
-25°C to 85°C, 16 GB, 2D NAND SDINBDG4-16G-I2
-40°C to 85°C, 16 GB, 2D NAND SDINBDG4-16G-XI2
-25°C to 85°C, 32 GB, 2D NAND SDINBDG4-32G-I2
-40°C to 85°C, 32 GB, 2D NAND SDINBDG4-32G-XI2
-25°C to 85°C, 64 GB, 2D NAND SDINBDG4-64G-I2
-40°C to 85°C, 64 GB, 2D NAND SDINBDG4-64G-XI2

 

 

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