Driving the Future of Transportation
online, on-demand
Exploring Next-Generation In-Vehicle Technologies and Connectivity Solutions
Join us for an insightful exploration into the future of automotive networking as we delve into the latest advancements transforming vehicle architecture. This event will showcase cutting-edge technologies and solutions that are supporting the next generation of software-defined vehicles.
From the integration of Single Pair Ethernet (SPE) and advanced connectivity solutions to the evolution of centralised E/E architectures, discover how these innovations are driving the future of automotive design. Learn from industry leaders as they share their expertise on enhancing vehicle communication, improving performance, and implementing robust, high-speed networking solutions.
Key Highlights:
- In-Vehicle Networking Innovations: Understand how next-generation technologies are paving the way for faster, safer, and more secure communication in tomorrow’s vehicles.
- Automotive Connectivity Solutions: Explore solutions for BLE and NFC applications and their impact on infotainment and centre console projects.
- Advancements in Ethernet Technology: Gain insights into the benefits and applications of Single Pair Ethernet, including Microchip’s Type B 1000BASE-T1 PHY Transceiver.
- Centralised E/E Architecture: Discover solutions for implementing zone and domain architectures and the expanded functionalities of V2X communication.
- The Role of CAN, LIN, and 10BASE-T1S: Learn how these technologies are contributing to the shift towards fully software-defined vehicles.
Don’t miss this opportunity to stay at the forefront of automotive innovation and gain valuable insights into the technologies shaping the future of transportation.
Agenda
Supplier | Session |
---|---|
NXP | In-Vehicle Networking for Transforming the Next Generation of Vehicle Architecture |
Renesas | Renesas Automotive Connectivity Solutions |
Microchip | Advancing Transportation Connectivity: Single Pair Ethernet and Microchip's Type B 1000BASE-T1 PHY Solutions |
Renesas | Renesas High Performance Products for V2X & TCU Application |
onsemi | The Role of CAN, LIN and 10BASE-T1S in the Move Towards Full Software-Defined Vehicles |
Partners




Topics
October 8th, 2024 – 10:35 AM - 11:25 AM CEST
In-Vehicle Networking for Transforming the Next Generation of Vehicle Architecture (NXP)
Presenters: Weibo Qiu & Ajay Kotian
Discover how next-generation in-vehicle networking technologies are paving the way for faster, safer, and more secure communication in tomorrow's software-defined vehicles. Our comprehensive vehicle networking portfolio, from LIN and CAN to FlexRay and Ethernet switches/PHYs, is designed to enhance existing networks and meet the demands of high-performance applications.
In this session, we’ll explore how these innovations are enabling the evolution of vehicle architectures and how we are driving the transformation within the transportation industry.
October 8th, 2024 – 11:30 AM - 12:20 PM CEST
Automotive Connectivity Solutions (Renesas)
Presenter: Edel Griffith
Explore solutions for BLE and NFC applications in the automotive industry, leveraging Renesas' extensive product portfolio. This session will provide an in-depth look at targeted applications, with a focus on infotainment systems and centre console projects.
October 8th, 2024 – 3:00 PM - 3:50 PM CEST
Advancing Transportation Connectivity: Single Pair Ethernet and Microchip's Type B 1000BASE-T1 PHY Solutions (Microchip)
Presenter: Mike Jones
The introduction of Single Pair Ethernet (SPE), led by automotive manufacturers, has brought significant reductions in weight, cost, and wiring complexity—benefits that extend across the broader transportation and mobility sectors. However, varying application requirements, particularly the need for longer reach cabling, must be addressed beyond the passenger vehicle market.
This presentation will provide an overview of SPE technology, its markets, and applications. We will highlight Microchip's SPE solutions, focusing on the 'Type B' longer reach 1000BASE-T1 PHY Transceiver, along with its interoperability and compliance.
October 9th, 2024 – 10:35 AM - 11:25 AM CEST
High Performance Products for V2X & TCU Application (Renesas)
Presenter: Edel Griffith
Explore the evolution of centralised E/E architecture and the solutions for implementing zone and domain architectures. This session will delve into the definition of TCU (Telematics Control Unit) and the expanded functionalities of V2X communication, with a focus on the Renesas RH850 product family.
October 9th, 2024 – 11:30 AM - 12:20 PM CEST
The Role of CAN, LIN and 10BASE-T1S in the Move Towards Full Software-Defined Vehicles (onsemi)
Presenter: Jon Harper
The rapid expansion of software-defined vehicle systems is driving major shifts in automotive networking architecture. This session will begin with a review of practical applications of CAN in front lighting systems and LIN in door controller systems.
We will then explore how Single Pair Ethernet (10BASE-T1S) solutions are integrating automotive electronic control units (ECUs) into the vehicle’s Automotive Ethernet network, allowing an increasing number of ECUs to become integral to the software-defined vehicle infrastructure.
Speakers
Product marketer for LIN & CAN SIC products in NXP
NXP
- Diploma:
- M.Sc. in Embedded Systems of TU Berlin & TU Eindhoven & Minor in Entrepreneurship. B.Sc. in Electronic Information Engineering of Communication University of China.
- Experience:
- Product marketer for LIN & CAN SIC products in NXP
- Support CAN, LIN, SBC business engagement in mass market
- Drive SW driver strategy for CAN, LIN, SBC products

Product Marketing Manager Ethernet PHY
NXP
- Experience:
- Joined NXP in 2022 and has been driving NXP's 100MB PHY Portfolio since 2023.
- Before NXP, served in technical roles at Micro Epsilon Optronics.
- Has more than 6 years of industry experience in Automotive, Semiconductors and IT.

Senior Manager
Renesas
- Diploma:
- Edel holds a BSc in Applied Physics and Electronics from the University of Galway, Ireland and a Diploma in Digital Marketing from Technological University Dublin.
- Experience:
- Edel Griffith is a Senior Manager in the Global Distribution Marketing team at Renesas. She has over 25 years of experience in the semiconductor industry in both R&D and technical marketing roles.
- Joined Renesas through the Dialog acquisition in 2021
- Working in Semiconductor companies Analog Devices, S3 Group, Adesto Technologies

Senior Marketing Manager, Automotive Ethernet
Microchip
- Diploma:
- Mike Jones has a 1st Class Masters Degree in Electronic Systems Engineering at Aston University in Birmingham, UK.
- Experience:
- More than 10 years of digital design experience in the telecoms industry followed by over 20 years high speed networking design in the semiconductor industry. He worked in partnership with Automotive OEMs to define and introduce the very first Automotive Grade Ethernet devices to market in 2008. Mike is a Senior Product Marketing Manager at Microchip Technology, responsible for Automotive Ethernet business strategy and roadmap definition.

Member of Technical staff, Industrial Discretes & Modules
onsemi
- Diploma:
- Jon Harper has a BSc/MEng Degree from the University of Bath (UK) and an MBA from the University of Warwick (UK).
- Experience:
- Jon Harper works in the Power Solutions Group product manager for industrial SiC power modules and discretes. He is responsible for new product definition and introduction. For the last two decades, Jon has had applications and technical marketing management roles in power electronics.

Registration
RELATED EVENTS

Discover the new FRDM Development Ecosystem from NXP – Empowering Engineers with the FRDM to Innovate!
We will introduce you to the i.MX 9x platform, provide an overview of the new FRDM ecosystem.

Discover the new FRDM Development Ecosystem from NXP – Empowering Engineers with the FRDM to Innovate!
We will introduce you to the i.MX 9x platform, provide an overview of the new FRDM ecosystem.

RISC-V & Low End FPGA’s for embedded systems
Wir freuen uns, Sie zu einem exklusiven Seminar einzuladen, das in Zusammenarbeit mit führenden Unternehmen der Halbleiterindustrie – AMD, Microchip und Renesas – stattfindet, um den Aufbruch in die RISC-V Welt aufzuzeigen.