AMD Integrated RF Solutions for Aerospace & Assured Communications
22 Apr 2026 - 22 Apr 2026
online
Modern aerospace and assured communications platforms are pushing RF architectures to handle wider bandwidths, denser multi channel arrays and ever stricter SWaP envelopes, all while maintaining secure, reliable links. In this session, AMD will share a market view of the forces shaping next generation systems and walk through the key engineering trade offs: performance versus power, converter resolution versus instantaneous bandwidth, latency versus flexibility, and how these choices play out under spectrum congestion and shrinking form factors.
The webinar then dives into the AMD integrated RF portfolio - Zynq™ UltraScale+™ RFSoC Gen 1–3, RFSoC DFE, Versal™ Core based RFSiP and Versal™ RF SoC, showing how their RF class data converters, adaptable logic and heterogeneous compute can accelerate array processing, enable ML at the edge, and support emerging requirements such as post quantum cryptographic security. You’ll leave with practical guidance on selecting the right device for your application and a clear set of resources to speed evaluation, prototyping and design.
Date and Time
22nd April 2026 - 3 pm CET/ 9 am EST
Duration of 1 hour
Agenda
- Market Introduction
- Industry Challenges and Trends
- Integrated RF Solution Portfolio
- Zynq UltraScale+ RFSoC Gen 1,2 and 3
- Zynq UltraScale+ RFSoC DFE
- Versal Core-based RFSiP
- Versal RF SoC
- Resources
Presenters
MILCOM & SATCOM System Architect
AMD
Biography:
Dan leads and manages AMD’s overall efforts for our existing and new FPGA-based and embedded x86 products in the MILCOM & SATCOM markets globally, defining next generation devices, design blocks (IP), and development tools to enable tomorrow’s mission critical communication and navigation systems. For over ten years, Dan developed aeronautical and space communication radios, architectures, and networks at NASA’s Glenn Research in Cleveland, Ohio, with special focus on FPGA-based waveform implementation for high-bandwidth, reconfigurable, RF and optical communication modems and navigation systems. Just before joining AMD in the spring of 2024, he was at Intel Labs and led the DSP implementation team for a photonic/ASIC/FPGA multi-standard optical modem that can be reconfigured on-orbit to enable communications across different standards to connect otherwise isolated satellite constellations. Dan received his bachelor’s degree in electrical engineering from Ohio State University in 2011. His eight published papers have been cited over 50 times, and he has 3 pending patents. In my 35+ years of career I successfully donned the hat of Test Engineer, Application Engineer and Product Marketing Manager at leading semiconductor manufacturing and testing organizations.
Aerospace & Defence EMEA Manager
Avnet Silica
Biography:
Luca Cereda is the Aerospace & Defence EMEA Manager at Avnet Silica with more than ten years of experience in the A&D distribution market. This role focuses on supporting A&D design in and demand creation for advanced semiconductor solutions. He works closely with OEMs and the BDM/FAE Silica team to align technology roadmaps with customer requirements. Passionate about new space and technology enthusiast he holds a master’s degree in telecommunication engineering from Politecnico di Milano, Italy.
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