The automotive industry is undergoing a fundamental transformation that we haven't seen since the introduction of the automobile. For 30 years, as a leader in automotive memory and storage solutions for in-vehicle infotainment (IVI), Micron has played a key role in enabling advanced drive-assistance systems (ADAS), autonomous vehicles, security and functional safety. Today's cars have evolved into virtual data centers on wheels, processing and storing massive amounts of data while demanding high compute and storage performance. Micron is driving the pace of change in the automotive and industrial industry with the product portfolio below.
- e.MMC / UFS
- NOR FLASH
- LPDDR
- DDR4/5
Easy integration, development and design gets you to market faster. Our fully managed e.MMC memory with built-in controller and interface helps you meet your storage requirements while getting your product to market quickly. Infotainment systems of next-generation connected vehicles employ multiple high-resolution displays with human machine interfaces that are based on artificial intelligence. Micron's UFS devices deliver the fast data access and processing that bring these systems to life.
eMMC
- Technology: 3D NAND 32T 2b/c (MLC), 3D NAND 64T 3b/c (TLC), 3D NAND 176T 3b/c (TLC)
- Firmware: e.MMC Specification, JESD84-B51
- Operating Temperature (Tcase): Grade 2 (-40°C to +115°C) AAT, Grade 3 (-40°C to +95°C) AIT
- Performance: Seq. Write: up to 120 MB/s, Seq. Read: up to 320 MB/s
- Packages: LFBGA153 (11.5x13x1.3mm), VFBGA153 (11.5x13x0.9mm), WFBGA153 (11.5x13x0.8mm)
UFS
- Technology: v2.1: 64T 3D TLC NAND, v3.1: 96T 3D TLC NAND, v3.1: 176T 3D TLC NAND
- UFS Specifications: JESD220C 2.1, JESD220D 3.1
- Operating Temperatures (Tcase): Grade 2 (-40°C to +105°C) – AAT, (-40°C to +115°C), Grade 3 (-40°C to +95°C) – AIT
- Package/Pinout: 153B TFBGA 11.5x13x1.2mm, SAC302, JEDEC, 153B TFBGA 11.5x13x1.2mm, SAC302, JEDEC-5Vss, 153 LFBGA 11.5x13x1.3mm SACQ, JEDEC-5Vss, 153 LFBGA 11.5x13x1.3mm SACQ, JEDEC-5Vss
Automotive memory must function in extreme environments. Our NOR flash memory offers a high-quality, small-footprint package with execute-in-place capabilities for engine control units and other applications that demand the highest reliability with lightning-fast boot times.
Product built for:
- Reliability
- Endurance
- Low latency
Xccela NOR
- Technology: Single Level Cell - 45nm
- Speed: 3.0V: 133MHz (STR/DTR), 1.8V: 200MHz (DDR with DQS)/ 166MHz (STR), 73.25 ns latency (XiP mode, 32-byte aligned reads)
- Voltages: 1.8V (1.7V – 2.0V), 3.0V (2.7V - 3.6V)
- I/O Bus Width: x1, x8
- Temperature Range: Automotive grade: -40˚C to +105˚C (AT), -40˚C to +125˚C (UT)
- Available Packages: TBGA24, x1/ x8 Boot
- AEC Q100 compliant
SPI NOR
- Technology: Single Level Cell - 45nm
- Speed: 1.8V: 166MHz(90MHz DTR), 3.0V: 133MHz(90MHz DTR)
- Voltage: 1.8V (1.7V – 2.0V), 3.0V (2.7V - 3.6V)
- I/O Bus Width: MT25Q x1/x2/x4, MT25T x1/x2/x4 and Twin Quad 2(x4) =x8
- Temperature Range: Automotive grade: -40˚C to +105˚C (AT), -40˚C to +125˚C (UT)
- Available Packages: DFN 6x5, SO8W, SO16W, TPBGA24, 1CLK/1CE and 2CLK/2CE configurations
- AEC Q100 compliant
Parallel NOR
- Technology: Single Level Cell - 45nm
- Access Time: 105ns Asynchronous
- I/O Bus Width: MT28EW - x8/x16, MT28FW - x16
- Temperature Range: Automotive Grade (-40˚C to +105˚C)
- Temperature Range: Automotive grade: -40˚C to +105˚C (AT), -40˚C to +125˚C (UT)
- Available Packages: TSOP56 14x20mm, LBGA64 11x13mm
- AEC Q100 compliant
Built to consume less power without sacrificing performance, our automotive LPDDR, LPDDR2, LPDDR4 and LPDDR5 memory solutions are perfect for instrument cluster, infotainment and ADAS solutions.
Product built for:
- Low power consumption
- High speed
- Performance
LPDDR4/4x
- Bus Width: x16 (SCx16), x32 (DCx16), x64 (QCx16)
- Packages: 200b BGA 10.0mm x 14.5mm
- Speed: 1600MHz / 3.2Gbps (-062), 1866MHz / 3.7Gbps (-053), 2133MHz / 4.2Gbps (-046)
- Temperature: -40°C to +95°C (AIT), -40°C to +105°C (AAT), -40°C to +125°C (AUT)
LPDDR5
- Bus Width: x64 (4Chx16), x32 (2Chx16)
- Package: 441b BGA 14.0mm x 14.0mm, 315b BGA 12.4mm x 15.0mm
- Speed: 6.4Gbps / -031 LP5, 7.5Gbps / -026 LP5x (All except Y31M), 8.5Gbps / -023 LP5x
- Temperature: -40°C to +125°C (AUT), -40°C to +105°C (AAT), -40°C to +95°C (AIT)
Automotive applications require memory to push the envelope in bandwidth, latency and power. Our SDRAM, DDR, DDR2, DDR3, DDR4 and DDR5 memory solutions deliver the requisite performance and more.
Product built for:
- High bandwidth
- High speed
- Performance
DDR5
- Voltage: 1.1V
- Package IOs: x8, x16
- Packages 1z: 82b BGA (x8), 102b FBGA (x16)
- Packages 1β: 78b/82b BGA (x8), 102b FBGA (x16)
- Data Rates: 4800MT/s on 1z, 6400 MT/s on 1β
- Temperature: -40°C to+125C (IU) on 1z, -40°C to +105°C (AT) on 1β node, -40°C to +125°C (UT) on 1β node
