Trenz Electronic TE0950

The Trenz Electronic TE0950-03-EGBE21A is a powerful adaptive SoC evaluation board, equipped with an AMD Versal™ AI Edge VE2302 device. Furthermore, the board is equipped with 8 GByte DDR4 SDRAM and 128 MByte SPI Flash for configuration and data storage as well as powerful switching power supplies for all required voltages. A large number of inputs and outputs are provided by robust, flexible and cost-effective high-speed connectors. Possible functional limitations and constraints in Vitis.

All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key features

• SoC
  • AMD Versal™ AI Edge XCVE2302-1LSESFVA784 device
    • A784 package (pin compatible VE2002, VE2102, VE2202, VE2302, VM1102)
• RAM/Storage
  • 8 GByte DDR4 SDRAM
  • 128 MByte SPI Flash (primary boot option)
  • MicroSD card (primary boot option)
  • 32 GByte e.MMC (secondary boot option)
  • EEPROM with MAC-address
• On Board
  • AMD Artix™ 7 FPGA as configurable Levelshifter/MUX for FMC and other 3.3 V IOs
    • 32 MByte SPI Flash
    • 1 dip switch
    • 2 LEDs
  • USB 2.0 Host/Device/OTG (type Micro A/B connector)
  • USB JTAG + UART Micro-USB B
  • Gigabit Ethernet RJ45
  • Output
    • 2 LEDs (1 x MIO, 1 x PL)
  • Input
    • 1 push button (PL)
    • 2 dip switches (MIO)
    • Reset button
• Interface
  • zQSFP with 4 GTYP Transceiver
  • 2 x CRUVI HS (each optimized for 4 Lane MIPI, one with reduced pinout)
  • 2 x CRUVI LS
  • CSI-2 connector (camera, 2 lane MIPI)
  • FMC
    • 4 GTYP Transceiver
    • 34 LA diff pairs to Levelshifter/MUX
• Power
  • 12 V plug for 2.1mm Power Jack
• Dimension
  • 150 mm x 120 mm

Block diagram