Quectel LTE EG95 series
LTE EG95 series - LTE Cat 4 IoT modules in an LGA package measuring 29.0mm × 25.0mm × 2.3mm
The EG95 is a series of LTE Cat 4 IoT modules in an LGA package measuring 29.0mm × 25.0mm × 2.3mm, which meets the 3GPP Release 11 standard. The EG95 is pin-to-pin compatible with Quectel’s UMTS/HSPA+ UG95 and UG96 modules, and LPWA BG95 and BG96 modules, enabling simple, flexible and scalable migration from 2G and 3G to 4G. The series consists of six variants to meet various geographical demands.
The EG95 provides cost-effective LTE connectivity, delivering maximum downlink rates of 150Mbps and uplink rates of 50Mbps under LTE, is designed using space-efficient surface mounted technology, and features an embedded power management unit for ultra-low deep-sleep current consumption. The series is therefore ideal for size-constrained, low-power IoT applications which are not reliant on high-speed connectivity but do require the longevity and reliability of LTE networks. It is also backward-compatible with existing UMTS/HSPA+ networks, ensuring that it can be connected even in remote areas devoid of 4G network coverage.
A wide range of internet protocols, industry-standard interfaces and functionalities (such as USB serial drivers for Windows 7/8/8.1/10, Linux and Android) allow the module to serve a wide range of IoT applications including industrial routers, industrial PDA, rugged tablet PC, and digital signage.
Features
- LTE Cat 4 module
- 29.0mm × 25.0mm × 2.3mm
- LGA package
- SMT form factor
- Max. downlink 150Mbps / uplink 50Mbps
- Extended temperature range of -40°C to +85°C
- Pin-to-pin compatible with Quectel’s UMTS/HSPA+ UG95 and UG96 modules, and LPWA BG95 and BG96 modules
- Multi-band LTE and UMTS/HSPA+ coverage
- Supports MIMO
- Supports DFOTA
- USB 2.0 interface
- Embedded power management unit
silica content library/npi/2022/quectel-lte-eg95-series
Quectel LTE EG95 series | Avnet Silica
