Renesas DA14531 Module Preview Pro Kit

The DA14531 SmartBond TINY™ Module, based on the world’s smallest and lowest power Bluetooth 5.1 system-on-Chip, brings the DA14531 SoC advantages to an integrated module. It just requires a power supply and a printed circuit board to build a Bluetooth application.

The module is targeting broad market use and will be certified across regions providing significant savings in development cost and time-to-market.
It comes with an integrated antenna and easy to use software making Bluetooth low energy development easier than ever before.

This awesome combination takes mobile connectivity to applications previously out of reach, enabling of the next billion IoT devices, with SmartBond TINY™ at their core.

Features

• Bluetooth 5.1 core qualified
• Integrated antenna
• Worldwide certification
• Cortex-M0+ @16MHz
• IoTMark™-BLE score of 18300
• 23.75uA/MHz MCU current
• Memory: 48kB RAM, 32kB OTP &1Mb FLASH
• 1.8-3.3V Supply Range
• +2.2dBM max output power
• -93dBm sensitivity
• Rx current 2mA at 3V
• Tx current 4mA at 3V at 0dBm
• Interfaces: 2xUART, SPI, I2C
• 4-channel 10-bit ADC
• 8 GPIO
• Built-in temperature sensor
• Operating temperature: -40°C to +85°C
• Dimensions: 12.5x14.5x2.8 mm

Applications

• Beacons
• Remote controls
• Proximity tags
• Toys
• Low power sensors
• Bluetooth LE add-on “pipe” to existing applications
• Provisioning of any type of equipment providing ease of use with smartphone APP-based based setup and control, eliminating the need for printed user manuals

Ordering information

• DA14531 SmartBond TINY Module
  • Part number: DA14531MOD-00F01002
  • Size (mm): 12.5x14.5x2.8
  • Shipment Pack Quantity: Reel 1k
• PREVIEW Bluetooth Low Energy Development Kit Pro for DA14531
  • Part number: DA14531MOD-00DEVKT-P
  • Description: PREVIEW Development Kit is based on module samples

SmartBond TINY Module includes motherboard, daughterboard and cables. Primary usage is SW application development and power measurements

Block diagram