Nexperia Schottky Rectifier in CFP packages

Clip-bonded FlatPower (CFP) packages with high power capabilities offer a true alternative to SMA, with better thermal performance.

Selected types

• PMEG60T10ELP
• PMEG60T10ELR
• PMEG60T20ELP
• PMEG60T30ELP
• PMEG60T30ELR
• PMEG60T50ELP

Key technical features and portfolio

• New portfolio with 60V & 100V Trench Schottkys
• AEC-Q101 qualified (175°C Tj)
• Existing portfolio offers up to 15 A forward current
• SOD123W (CFP3), SOD128 (CFP5) and SOT1289B (CFP15B)

Design benefit

• Smallest form factor, PCB space saving
• Highest efficiency by electrical performance
• Improved thermal robustness - reduced risk of thermal runaway
• Best balance between forward voltage and reverse current

Advanced CFP packaging

• Solid copper clip for high thermal performance and power dissipation
• Reduced package inductance for improved switching behavior
• Innovative silicon and reduced package resistance for better electrical performance

Functions & applications

• Rectification in power supply (e.g. USB/PD)
• DCDC conversion
• Reverse battery protection 
• Or-ing (several supply sources)
• Free wheeling diode

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