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STMicroelectronics STM32MP251C→STM32MP251CAJ3

 

MPU with Arm Cortex-A35 @1.2GHz, Cortex-M33 @400MHz, 1xEthernet, Secure Boot, Cryptography, DRAM enc/dec, PKA

STMicroelectronics STM32MP251C→STM32MP251CAJ3 product image

STM32MP25xC/F devices are based on the high-performance single or dual-core Arm® Cortex®-A35 64-bit RISC core operating at up to 1.5 GHz. The Cortex®‑A35 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU, and a 512-Kbyte L2 cache.

The Cortex®‑A35 processor uses a highly efficient 8-stage in-order pipeline that has been extensively optimized to provide full Armv8-A features while maximizing area and power efficiency. STM32MP25xC/F devices also embed a Cortex®-M33 32-bit RISC core operating at up to 400 MHz frequency, which features a floating point unit (FPU) single precision that supports Arm® single-precision data-processing instructions, and data types.

The Cortex®-M33 supports a full set of DSP instructions, TrustZone®, and a memory protection unit (MPU) which enhances application security. STM32MP25xC/F devices can also embed a 3D graphic processing unit (VeriSilicon®, OpenGL ES 3.1, Vulkan 1.3, OpenCL 3.0, OpenVX 1.3) running at up to 900 MHz, with performances up to 150 Mtriangle/s, 900 Mpixel/s.

 

Key features

  • Includes ST state-of-the-art patented technology.
  • Cores
  • Up to 64-bit dual-core Arm® Cortex®-A35
    • Up to 1.5 GHz32-Kbyte I + 32-Kbyte D level 1 cache for each core512-Kbyte unified level 2 cacheArm® NEON™ and Arm® TrustZone®
  • 32-bit Arm® Cortex®-M33 with FPU/MPUUp to 400 MHz
    • L1 16-Kbyte I / 16-Kbyte D Arm® TrustZone®
  • 32-bit Arm® Cortex®-M0+ in SmartRun domain
    • Up to 200 MHz (up to 16 MHz in autonomous mode)
  • Memories
    • External DDR memory up to 4 Gbytes
      • Up to DDR3L-2133 16/32-bit
      • Up to DDR4-2400 16/32-bit
      • Up to LPDDR4-2400 16/32-bit
    • 808-Kbyte internal SRAM: 256-Kbyte AXI SYSRAM, 128-Kbyte AXI video RAM or SYSRAM extension, 256-Kbyte AHB SRAM, 128-Kbyte AHB SRAM with ECC in backup domain, 8-Kbyte SRAM with ECC in backup domain
    • Two Octo-SPI memory interfaces
    • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs, and SLC NAND memories with up to 8-bit ECC
  • Security/safety
    • Secure boot, TrustZone® peripherals, active tamper, environmental monitors, display secure layers, hardware accelerators
    • Complete resource isolation framework
  • Reset and power management
    • 1.71 to 1.95 V and 2.7/3.0 to 3.6 V multiple section I/O supply
    • POR, PDR, PVD, and BOR
    • On-chip LDO and power-switches for RETRAM, BKPSRAM, VSW, and SmartRun domains
    • Dedicated supplies for Cortex®-A35 and GPU/NPU (if present)
    • Internal temperature sensors
    • Low-power modes: Sleep, Stop, and Standby
    • DDR memory retention in Standby mode
    • Controls for PMIC companion chip
  • Low-power consumption
  • Clock management
    • Internal oscillators: 64 MHz HSI, 4/16 MHz MSI, 32 kHz LSI
    • External oscillators: 16-48 MHz HSE, 32.768 kHz LSE
    • Up to 8× PLLs with fractional mode
  • General-purpose inputs/outputs
    • Up to 172 secure I/O ports with interrupt capability
    • Up to 6 wake-up inputs
    • Up to 8 tamper input pins + 8 active tampers output pins
  • Interconnect matrix
    • Bus matrices
      • 128-, 64-, 32-bit STNoC interconnect, up to 600 MHz
      • 32-bit Arm® AMBA® AHB interconnect, up to 400 MHz
  • 4 DMA controllers to unload the CPU
    • 48 + 4 physical channels in total
    • 3× dual master port, high-performance, general-purpose, direct memory access controller (HPDMA), 16 channels each
    • 1× low-power DMA controller with 4 channels in SmartRun domain
  • Up to 51 communication peripherals
    • 8× I2C FM+ (1 Mbit/s, SMBus/PMBus®)
    • 4× I3C (12.5 Mbit/s)
    • 5× UART + 4× USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI) + 1× LPUART
    • 8× SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)(+2 with OCTOSPI + 4 with USART)
    • 4× SAI (stereo audio: I2S, PDM, SPDIF Tx)
    • SPDIF Rx with 4 inputs
    • 3× SDMMC up to 8-bit (SD/e•MMC™/SDIO)
    • Up to 3× CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
    • 1× USB 2.0 high-speed Host with embedded 480 Mbits/s PHY
    • 1× USB 2.0/3.0 high-speed/SuperSpeed dual role data with embedded 480 Mbits/s and 5 Gbits/s PHY (5 Gbits/s PHY shared with PCI Express)
    • 1× USB Type-C® Power Delivery control with two CC lines PHY
    • 1 × PCI Express with embedded 5 Gbits/s PHY (PHY shared with USB 3.0 SuperSpeed)
    • Up to 3× Gigabit Ethernet interfaces
      • 1× Gigabit Ethernet GMAC with one PHY interface (optional)
      • 1× Gigabit Ethernet GMAC with one external PHY interface
    • Camera interface #1 (5 Mpixels @30 fps)
      • MIPI CSI-2®, 2× data lanes up to 2.5 Gbit/s each
      • 8- to 16-bit parallel, up to 120 MHz
      • RGB, YUV, JPG
    • Camera interface #2 (1 Mpixels @15 fps)
      • 8- to 14-bit parallel, up to 80 MHz
      • RGB, YUV, JPG
      • Cropping
    • Digital parallel interface up to 16-bit input or output
  • 7 analog peripherals
    • 3 × ADCs with 12-bit max. resolution (up to 5 Msps each, up to 23 channels)
    • Internal temperature sensor (DTS)
    • 1× multifunction digital filter (MDF) with up to 8 channels/8 filters
    • 1× audio digital filter (ADF) with 1 filter and sound activity detection
    • Internal (VREFBUF) or external ADC reference VREF+
  • Graphics
    • Optional 3D GPU: VeriSilicon® - Up to 900 MHz
      • OpenGL® ES 3.1 - Vulkan 1.3
      • OpenCL™ 3.0, OpenVX™ 1.3
      • Up to 150 Mtriangle/s, 900 Mpixel/s
    • LCD-TFT controller, up to 24-bit // RGB888
      • Up to FHD (1920 × 1080) @60 fps
      • 3 layers including a secure layer
      • YUV support, 90° output rotation
    • Optional MIPI DSI®, 4× data lanes, up to 2.5 Gbit/s each
      • Up to QXGA (2048 × 1536) @60 fps
    • Optional FPD-1 and OpenLDI JEIDA/VESA (LVDS), up to 2× links of 4× data lanes, up to 1.1 Gbit/s per lane
      • Up to QXGA (2048 × 1536) @60 fps
  • Artificial intelligence
    • Optional NPU: VeriSilicon® - Up to 900 MHz
      • TensorFlowLite - ONNX - Linux NN
  • Video processing
    • Optional hardware video encoder and decoder up to 600 MHz
      • H264/VP8 up to FHD (1920×1080) @60 fps
      • JPEG up to 500 Mpixel/s
      • 128 Kbytes of video RAM
  • Up to 34 timers and 7 watchdogs
    • 4× 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
    • 3× 16-bit advanced motor control timers
    • 10× 16-bit general-purpose timers (including 2 basic timers without PWM)
    • 5× 16-bit low-power timers
    • Secure RTC with subsecond accuracy and hardware calendar
    • Up to 2× 4 Cortex®-A35 system timers (secure, non-secure, virtual, hypervisor)
    • 2× SysTick Cortex®-M33 timer (secure, non-secure)
    • 1× SysTick Cortex®-M0+ timer
    • 7× watchdogs (5× independent and 2× window)
  • Hardware acceleration
    • AES-128, -192, -256, DES/TDES
    • Secure AES-256 with SCA
    • RSA, ECC, ECDSA
    • with SCA
    • HASH (SHA-1, SHA-224, SHA-256, SHA3), HMAC
    • True random number generator
    • CRC calculation unit
    • “On-the-fly” DDR encryption/decryption (AES-128)
    • “On-the-fly” OTFDEC Octo-SPI flash memory decryption (AES-128)
  • Debug mode
    • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
  • 12288-bit fuses including 96-bit unique ID
  • All packages are ECOPACK2 compliant

 

Applications

  • Smart factories
  • Cities, and buildings
  • Advanced HMI applications
  • Medical devices

 

 

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