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onsemi PowerTrench T10 80V​ MOSFETs in TCPAK1012

80V PowerTrench T10 MOSFETs in top-cool 10x12 package - 1.4 mΩ, 0.79 mΩ, 0.64 mΩ, 1.19 mΩ

onsemi PowerTrench T10 80V​ MOSFETs in TCPAK1012 product image

Automotive-grade  PowerTrench® T10 80V Mosfet in TCPAK1012 top cool package. AEC-Q101 Qualified and PPAP capable for high-efficiency automotive power designs.

Building on the success of our established Top Cool 5x7 mm package technology, TCPAK1012 delivers enhanced power handling capability while maintaining the thermal management advantages that eliminate the PCB from the heat conduction path. By directing heat flow directly from the junction to the heatsink through the package top, TCPAK1012 provides superior thermal performance, increased power density, and exceptional design flexibility for the most demanding high-power applications.

 

Key features

  • Industry’s lowest RDS(on) – 0.56 mΩ
  • Thermal resistance improved by approximately 30–40% versus TOLL
  • Demonstrates up to ~50% thermal impedance reduction versus TOLL, ensuring superior pulse-handling capability
  • Largest exposed pad area – 55 mm2
  • Compact design – 10x12 mm2 package size
  • Negative standoff
  • Meets qualification standard beyond AEC-Q101
  • PPAP Capable

 

Applications

  • Synchronous rectifier in on-board chargers
  • 48V DCDC converter
  • 48V starter generator
  • Power switches (high side driver, low side driver, H-Bridges etc.)

 

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