Octavo OSD32MP15x System-in-Package

The OSD32MP15x module is the first System in Package based on the STMicroelectronics STM32MP1.  Delivering all the power of a full Microprocessor system in a package that feels like a Microcontroller, the OSD32MP15x has a footprint that is the same size as the ST32MP1 itself.  The SiP integrates the STM32MP15x Dual Core Arm® Cortex® A7 and an Arm® Cortex® M4, up to 1GB DDR3, STPMIC1 Power Management IC, EEPROM, MEMS Oscillator, and passives into single BGA package.

At only 18mm x 18mm, the OSD32MP15x brings developers a footprint that is up to 64% smaller than an equivalent design with discrete components.  Integrated into a BGA with all signals escaped into one layer, this system in package means faster designs and simplified supply chain.

STM32MP1 highlights

Along with the Dual Core Arm® Cortex® A7 and an Arm® Cortex® M4, the STM32MP15x microprocessor also incorporates a 3D GPU OpenGL ES2.0 Graphics processor, 2 x 22 channels of 16bit ADC and a host of connectivity including a camera interface.  For control, the ST32MP15x provides 2x 16-bit PWM, up to 29 timers and 3 watchdogs.  For the growing market of internet connected applications,  it offers TrustZone®, TDES, AES-256 security features.

The Cortex M4 and peripherals in the STM32MP15x are compatible with ST’s stand alone M4 devices. Code ports seamlessly from existing M4 designs. The integration provided by the OSD32MP15x SiP makes the transition even easier, removing the hardware complexities associated with a processor design.

STPMIC1 highlights

The STPMIC1 within the OSD32MP15x SiP module is designed to pair with needs of ST32MP15x customers.  It requires only a single input voltage for the processor and provides an integrated 5.2V Boost as well as a Buck, 4 LDOs and 2 power switches for use in the system.

Features

• Integrated into a single BGA Package:
  • STMicroelectronics STM32MP15x microprocessor SoC with Dual Arm® Cortex® A7 and Arm® Cortex® M4
  • STPMIC1 Power Management IC (PMIC)
  • up to 1GB DDR3L Memory
  • 4KB Non-Volatile EEPROM
  • MEMS Oscillator
  • Over 100 Passives
• ST32MP15x Features:
  • Arm® Cortex®-A7 up to 800MHz x2
  • Arm® Cortex®-M4 up to 209MHz
  • NEON™SIMD Coprocessor x2
  • TrustZone®
  • USB 2.0 HS + PHY x2
  • Ethernet 10/100/1000
  • CAN FD/TTCAN x2, UART x4, USART x4,SPI x6, I2C x6, SAI x4, QSPI, SPDIF, I2S x3
  • eMMC/SD/SDIO Ports x3
  • GPIO x148
  • 24-bit RGB Display, MIPI DSI
  • Camera Interface
  • 22 Channel 16-bit ADC x2, 12-bit DAC x2
• Access to all signals of the STM32MP1 TFBGA 361 package
• STPMIC1 Power Management IC Features:
  • Single Voltage Input: 2.8V-5.5V
  • Integrated Boost: 5.2V
  • System Power: Buck LDOx4, Power Switch x2
• 302 Ball BGA (18mm x 18mm)
• 18 x 18 grid, 1mm Pitch
• Case Temp Range: 0° to 85°C, -40° to 85°C

Block diagram