H&D Wireless HDG229

HDG229 is a highly integrated WLAN and Bluetooth module ready to enable onboard connectivity in Linux platforms. The 8x8mm plastic overmold module enables a feature rich client solution providing up to 150 Mbps data rate. HDG229 fully supports concurrent or independent operation of WLAN and Bluetooth. The module is built on a latest generation 28nm chipset supporting lowest power and highest performance. The HDG229 connects to the host through SDIO (WLAN and BT) and high speed UART (BT only) interfaces. The module comes with an integrated sputtered shield for shortest time to market and super small footprint fulfilling regulatory demands.

The HDG229 SiP is based on a 88W8977 NXP chipset.

Key features

• Support for 802.11a/b/g/n
• Data Rates: 72 Mbps (20 MHz channel), 150Mbps (40 MHz channel)
• Modulation: BPSK, CCK, QPSK, 16QAM, 64QAM for WLAN
• Fully functional Bluetooth 5 baseband
• Open WEP, WPA/WPA2 encryption
• Minimum of external components
• Low power consumption due to efficient PA design and power off mode
• Supporting STA and AP operation mode
• Supports BT-WLAN coexistence and ISM-LTE coexistence
• Extensive DMA hardware support for data flow to reduce CPU load.
• Advanced power management for optimum power consumption at varying load.
• External interfaces 4 bit SDIO 3.0 for WLAN and PCM for BT interface
• On-board High Frequency High Precision Oscillator 26 MHz
• Small footprint 8.0 x 8.0 mm (64mm2) 42-pin LGA package
• RoHS Compliant