Automotive Applications of GaN Power Semiconductors

An EV charger using GaN technologyEV charging is one of many use-cases for GaN technology

The automotive industry is undergoing the biggest change in its history, as it shifts from internal combustion engines (ICE) to electric power. While the electric powertrain is a well-proven technology by now, there’s continued pressure to achieve greater range and faster battery changing – raising the bar of what’s expected of power electronics components.

Silicon is the incumbent semiconductor material for power applications, but in our cars, it’s being replaced by wide bandgap (WBG) materials that offer improved efficiency and greater power density.

The two most commonly used WBG materials are gallium nitride (GaN) and silicon carbide (SiC). Although it offers excellent performance, GaN is typically only suited for applications up to around 650 V. 

Where higher voltages are needed, such as in a typical traction inverter, then silicon or SiC is often more suitable, although the technical limits of GaN continue to expand as new devices are developed.

For these low and medium voltage applications, GaN offers higher efficiency compared to silicon. This is due to multiple factors, including GaN devices’ higher switching frequencies, its zero reverse recovery losses, and its lower drain to source on-state resistance (RDS(on)) than silicon, which reduces conduction losses.

In power applications, the most common GaN device is the lateral high electron mobility transistor (HEMT). In this article, we will explore some of the most common automotive applications for GaN HEMTs and field-effect transistors (FETs), and why GaN’s advantages make it a preferred choice – specifically, its excellent efficiency and high power density.

GaN applications in electric vehicles

In an electric vehicle (EV), GaN is typically found in the onboard charger (OBC), which converts AC power from the grid into DC that can charge the battery. This is for charging from a standard or low-power AC outlet, for example plugging into a regular socket at your home. An OBC is typically rated between about 1.2 kW and 7 kW for single-phase versions, and up to around 22kW for less common three-phase options.

GaN devices can also be used in EV fast charging systems within rapid, high-voltage DC charging stations often found in public locations. These can deliver power up to around 100 kW in a typical installation, enabling an EV to charge its battery from 10% to 80% in something like 30 minutes1. So-called ‘ultra-rapid’ chargers can go even faster, with power ratings of up to 350 kW and charging from 10% to 80% in 20 minutes or less, depending on the car’s capabilities.

Another application is the EV’s on board DC/DC converter, where GaN’s efficiency and high power density are key. For all these automotive applications, GaN-based devices also need to deliver excellent reliability, and to meet the stringent requirements of automotive quality standards such as AEC-Q101.

While the discussion in this article is focused on EVs that only contain an electric powertrain, with no conventional diesel or petrol engine, the same principles also apply to hybrid vehicles, including mild hybrids, conventional hybrids (HEVs), and plug-in hybrids (PHEVs).

GaN semiconductors in OBC design and V2G

Let's take a closer look at one specific application: the onboard charger (OBC). This device is crucial for converting AC power from the grid into DC to charge the EV's battery. OBCs can be designed as unidirectional, for charging only, or bidirectional, which allows for vehicle-to-grid (V2G) capabilities, enabling the car to feed power back to the grid.

An example of a high-efficiency OBC design is shown in Figure 1, consisting of a ‘Totem-Pole’ PFC stage, followed by an isolated ‘CLLC’ DC-DC conversion stage2.

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With the ongoing shift to renewable energy and the electrification of transport and industry, the demand for higher power and greater energy efficiency in electronics is increasing. Wide bandgap technologies including SiC and GaN bring many advantages.

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GaN semiconductors in OBC design and V2G (LC)

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In this example, the totem-pole PFC stage is operated in hard-switched continuous conduction mode (CCM), which keeps peak currents lower. GaN devices are a good choice because, although care needs to be taken during dead time, there are no reverse recovery losses, which would be significant with silicon MOSFETs. The voltage stress with the single-phase supply shown is limited to the AC peak and is comfortably within the range of 650 V GaN devices.

The CLLC stage (Q5-8) operates in a resonant manner, meaning that under normal conditions, the body diodes of the switches are not expected to conduct due to the AC nature of the resonant current. While SiC MOSFETs can offer similar dynamic and static losses to GaN in this application, the choice between the two may also consider factors such as switching frequency, thermal management, and system-level design considerations (such as using diodes in parallel with the GaN devices). SiC MOSFETs can also sometimes be a more cost-effective option with less stringent gate drive requirements, particularly for the high-side switches in the CLLC stage.

The output synchronous rectifiers (Q9-12) also switch resonantly and can be SiC devices for batteries up to 800 V or even a little higher. Although silicon works well enough in lower voltage applications, GaN's lower capacitances may provide advantages in dynamic and conduction losses.

Engineers may also employ GaN in higher voltage designs by stacking transformer windings and using separate rectification stages, although this is a more advanced technique.

Example GaN devices (Product Highlights)

The VIPERGAN and MASTERGAN series from STMicroelectronics comprise GaN-based offline converters designed to work in multiple modes to deliver the highest efficiency based on the application and the load. 
Discrete GaN suppliers with products now available with design support from Avnet Silica include Navitas Semiconductor and Nexperia.

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Design considerations for GaN power devices in automotive applications

The high frequency switching of GaN-based devices means that design engineers need to consider potential issues with noise and electromagnetic interference (EMI), which require careful PCB layout, as well as parasitic inductances.

Thermal management can also be a challenge. GaN HEMTs’ high power density means dissipating heat can be more difficult, particularly in compact and restricted spaces within a vehicle.

The future for GaN in automotive applications

The market for power GaN devices will grow from US$260 million in 2023 to US$2.5 billion by 2029, with GaN revenues from automotive and mobility expected to exceed US$750 million, according to Yole Group3.

With some GaN devices already reaching cost parity with silicon, the future increase in volume will help push costs even lower. Leveraging silicon substrates for GaN device fabrication will also allow manufacturers to utilise established silicon processing techniques and existing production infrastructure.

While GaN devices are at present limited to around 650 V, manufacturers are continually innovating, with hopes that new devices could operate up to 1200 V or even more. This will enable GaN to find more applications in EVs, as well as responding to the trend in EV architectures shifting from 400 V to 800V.

Choosing the right material

Selecting the appropriate semiconductor material for automotive applications is a critical decision that hinges on various factors, including efficiency, power density, cost, and reliability.

Avnet Silica’s Field Application Engineers (FAEs) and power experts have extensive experience in the automotive market and can help you make the right decision for your application – whether that is GaN, SiC or silicon. Talk to us to find out more.

Reference

[1] https://www.rac.co.uk/drive/electric-cars/charging/electric-car-charging-speeds/
[2] https://my.avnet.com/silica/resources/article/understand-practical-gan-and-sic-differences-for-ev-onboard-chargers/ (note to reviewers – content for this section in the draft is mostly based on this article)
[3] https://www.yolegroup.com/strategy-insights/from-power-to-rf-gans-journey-to-a-us4-35b-market-by-2029/

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