Extensive power portfolio
Nexperia is a prominent player in the semiconductor industry, known for its high-quality and reliable discrete components, power, and logic ICs. The company is dedicated to innovation, continuously expanding its portfolio with a focus on power MOSFETs, wideband gap semiconductors, IGBTs, and analog & power management ICs. Each year, Nexperia introduces over 800 new types, with more than 70 new parts in analog & power management released in 2024 alone.
Significant investments and strategic partnerships
Among others, Nexperia has committed $200 million to SiC and GaN technology at its Hamburg factory, enhancing production capabilities and meeting future demands. Strategic partnerships boost the technological development and adoption in key applications. Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 12,500 employees across Europe, Asia, and the United States. Shipping more than 100 billion products annually, Nexperia maintains a strong global presence, ensuring robust support and efficient supply chain management.
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USB-C: The Smarter Power Solution
USB Type-C Power Delivery (USB-C PD) is transforming the way devices are powered, establishing itself as the global standard for efficient energy transfer. No longer confined to conventional electronics, USB-C PD now extends to high-performance computing, e-mobility, and industrial automation, enabling universal and intelligent power management.
The Rise of Intelligent Robotics
Robotics is transforming the way we live and work. In today’s fast-paced industrial landscape, robots are not only enhancing productivity — they’re also reshaping how tasks are performed across factories, warehouses, and logistics hubs.
Intelligent Energy Management and Storage Solutions
As the global energy landscape shifts toward decentralization, electrification, and real-time optimization, the demand for secure, scalable, and intelligent energy systems is greater than ever.
Advanced Automotive Power Solutions
Join Avnet Silica and our key technology partners for a digital experience dedicated to the future of electrified mobility. As the automotive industry accelerates toward smarter, safer, and more sustainable electric vehicles, the demands on power electronics, system efficiency, and design innovation have never been higher.
SiC based converter design for efficient DC microgrid systems with Nexperia
DC Microgrids, as a specialized form of smart grid, have gained popularity in recent years. With their ability to function as self-contained entities, equipped with their own energy resources, control mechanisms, and often energy storage capabilities, microgrids offer promising solutions for energy resilience and sustainability.
Applications pages
Nexperia Residential Heat Pump
As demand rises for ever more efficient heating and cooling of homes, this has seen a significant push towards efficient residential heat pumps. As a direct replacement for gas condensing boilers and air conditioning units, residential heat pumps can provide year-round comfort control by supplying heat in the winter and cooling in the summer. For newer buildings and specifically for net zero carbon buildings less than 150 m2 then typical heating power ratings are below 6 kW. Regardless of whether they are air-to-air or air-to-water systems, efficiency and carbon footprint can be further improved when powered by a photovoltaic (PV) installation.
Nexperia Residential EV Wall Boxes
Residential EV wall boxes are essential for adoption of electrical vehicles. They enable convenient home charging, reduce reliance on public infrastructure, and support smart energy use and integration with home solar systems. This makes EV ownership more practical, cost-effective, and environmentally friendly. As the numbers of electrical vehicle grow, wall boxes play a key role in scaling charging infrastructure.
Articles that mention Nexperia
Powering the Future of SiC with Advanced Top-Side Cooling
SiC brings undeniable advantages in switching speed, efficiency, and voltage handling, but material capability alone does not guarantee system performance. What ultimately matters is how the device is fabricated and assembled. Packaging, cooling, and integration turn SiC’s promise into measurable gains. Nexperia’s top-side cooled X.PAK devices illustrate this point: by refining thermal paths, minimising parasitics, and ensuring mechanical strength, they show that design discipline at the package level can unlock performance beyond traditional TO-263-7 devices.
For engineers, the challenge is to carry that same thinking into the system. Interface quality, mounting pressure, and overall assembly can define how much power a SiC device truly delivers in the field. A strong device still needs a strong thermal connection to its environment to sustain performance under real operating conditions.
While semiconductor material innovation creates the potential, packaging and integration turn it into performance. Recognising and optimising across these layers, from manufacturers such as Nexperia designing SiC semiconductors to engineers integrating the device, enables the creation of compact, efficient, and durable power systems that meet the growing demands of electric mobility and industrial automation.
Efficiency Gains of SiC Modules
Silicon carbide’s advantages over IGBTs including lower conduction losses. The linear characteristics of SiC and switching frequency are key to its value. We look at these figures of merit as they apply to SiC modules available now.
Accurate Loss Calculation for SiC Devices
Loss calculations are a critical part of power design. These include conduction and switching losses, and the impact of thermal losses. We look at the tools and methodologies available to help engineers find the right design selection.
Five Things to Consider Before Switching to SiC in Power Conversion
SiC MOSFETs are often presented as an attractive upgrade to older technologies such as IGBTs and Silicon MOSFETs. Although in some limited cases, SiC can be a drop-in replacement, to get maximum benefit, the system should be considered as a whole. To explain more, the Avnet Silica Power Specialists discuss five example areas which affect your design approach.
Automotive Applications of GaN Power Semiconductors
Silicon is the incumbent semiconductor material for power applications, but in our cars, it’s being replaced by wide bandgap (WBG) materials that offer improved efficiency and greater power density.
The two most commonly used WBG materials are gallium nitride (GaN) and silicon carbide (SiC). Although it offers excellent performance, GaN is typically only suited for applications up to around 650 V.
Gallium Nitride Power Semiconductors: An Overview
While silicon has been the most important material in power electronics for decades, silicon-based devices are now reaching their material’s physical limits.
In response to the ever-growing demand for efficiency, as well as greater power density, the industry is turning to new semiconductor materials to replace silicon. Wide bandgap (WBG) semiconductors, such as gallium nitride (GaN), have many advantages over silicon, enabling lower losses and smaller devices.
Silicon Carbide Power Semiconductors: An Overview
The practical result of having a wider bandgap is properties that become extremely useful for power electronics, including reduced conduction and switching losses, allowing for faster switching and better efficiency. Due to its wide bandgap, SiC can also operate at temperatures and voltages higher than silicon. Correspondingly, a SiC power IC delivers the same performance as a silicon power IC in a smaller and lighter package.
In this article, we provide an overview of SiC and its advantages for power electronics applications.
Applications of Wide Bandgap Power Semiconductors
Compared to silicon, WBG devices have some important advantages: improved power efficiency, higher operating temperatures, and a smaller die, to name just a few. Various WBG devices are available, including SiC MOSFETs, SiC Schottky diodes, and GaN FETs, enabling design engineers to choose the right option for their application.
In this article, we’ll examine some of the most popular uses for WBG semiconductors, including automotive, industrial, and telecoms. We’ll also discuss why WBG devices have an advantage over silicon in each case.
Nexperia CCPAK1212 MOSFETs
Nexperia’s JEDEC-standard copper-clip CCPAK1212 MOSFET packaging pushes the limits of performance and efficiency. With a compact 12x12 mm footprint, it offers two cooling options: bottom-side cooled CCPAK1212 and inverted, top-side cooled CCPAK1212i.
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Nexperia LFPAK88 MOSFETs
Providing a true alternative to D²PAK, Nexperia’s LFPAK88 delivers industry leading power density in truly innovative 8mm x 8mm footprint. Delivering 2x higher continuous current rating, ultimate thermal performance and reliability, and up to 60% space saving efficiency, making LFPAK88 the MOSFET of choice for the most challenging new designs. Available in both automotive AEC-Q101 and industrial grades.
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Nexperia MLPAK33 MOSFETs
Designers are increasingly dealing with space-constrained systems. Nexperia’s MLPAK33 MOSFETs offer footprint compatibility with the industry-known DFN3333. Delivering optimized RDS(on) in a space-saving package with the added benefit of micro-leads, these devices are ideal for a wide range of industrial, consumer, computing, and mobile applications.
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Highly Efficient Motor Control for Robotics Design
Robotics is transforming the way we live and work. In today’s fast-paced industrial landscape, robots are not only enhancing productivity — they’re also reshaping how tasks are performed across factories, warehouses, and logistics hubs.
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Our experts bring insights that extend beyond the datasheet, availability and price. The combined experience contained within our network covers thousands of projects across different customers, markets, regions and technologies. We will pull together the right team from our collective expertise to focus on your application, providing valuable ideas and recommendations to improve your product and accelerate its journey from the initial concept out into the world.