Nexperia CCPAK1212 MOSFETs

Nexperia’s JEDEC-standard copper-clip CCPAK1212 MOSFET packaging pushes the limits of performance and efficiency. With a compact 12x12 mm footprint, it offers two cooling options: bottom-side cooled CCPAK1212 and inverted, top-side cooled CCPAK1212i. These packages deliver up to 1.5 kW power ratings, low electrical and thermal resistance, high current density, and best-in-class SOA performance, ensuring superior reliability and efficiency for the high-power demands of next-generation industrial applications.

Top-side and bottom-side cooling
The CCPAK1212 series features a 12x12 mm footprint with bottom-side cooled CCPAK1212 and top-side cooled CCPAK1212i options, providing design flexibility, improved thermal management, and high performance in a compact size.
The benchmark PSMN1R0-100ASF is a 0.99 mΩ 100 V power MOSFET capable of conducting 460 A and dissipating 1.55 KW of power, yet in a CCPAK1212 package footprint that occupies only 12x12 mm of board space. The PSMN1R0-100CSF offers similar statistics in a top-side cooled version.

Key features

• High power rating (1.5 kW) in a compact 12x12 mm package
• Ultra-low R_DS(on) for low I²R conduction losses
• Best-in-class linear mode (SOA), in-rush & surge protection
• Copper-clip technology gives low electrical & thermal resistance
• High performance silicon
• Outstanding board level reliability

Applications

• High-power BLDC motor control
• High-power conversion (DC/DC & AC/DC)
• Battery management & protection
• Residential / commercial heat pump
• Renewable energy storage
• Hotswap for communication infrastructure
• Battery management systems
• Renewable energy

Product portfolio

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