SolidRun Ryzen RAI300
Ryzen RAI300 - Powerful Fanless Industrial PC Solution
Bedrock RAI300 is powered by the state-of-the-art AMD Ryzen AI 9 HX 370 processor with 12 Zen 5 cores and 24 threads running at up to 5.1 GHz, RDNA 3.5 iGPU, and the XDNA 2 NPU.
Features
- Unlock the Full Potential of Edge AI
- Remarkable Fanless Cooling
- Full Control of CPU Power
- Rock Solid Reliability
- Innovative Modular Design
- Painless Integration
- Field Usability
- The 0.6 liter Bedrock Tile
- Advanced Integration Using Deck
- Designing with Bedrock SoM
Specifications
| Feature | Specification | Notes |
|---|---|---|
| CPU | AMD Ryzen™ AI 9 HX 370 12C/24T Zen5 4nm Up to 5.1 GHz Up to 54W |
|
| GPU | AMD Radeon™ 890M | 16 CU @ 2900 MHz |
| NPU | AMD Ryzen™ AI 50 TOPS | AMD Ryzen™ AI 50 TOPS |
| AI Acceleration | Up to 2x Hailo-8 M.2 AI Inferencing Acceleration Module 26 TOPS Up to 2x Hailo-10 M.2 Generative AI Acceleration Module 40 TOPS |
2x M.2 key-M 2242 (each precludes an NVME) |
| RAM | 128 bit DDR5 5600 up to 128 GB | 2x SODIMM (2×32 bit each), conduction cooled |
| TPM | fTPM 2.0 (in Ryzen) + dTPM 2.0 (Infineon) | Select in BIOS |
| Display | Up to 4 display outputs HDMI 2.1 | DisplayPort 2.1 | Max resolution / refresh rate: 7680×4320 @ 60Hz 3840×2160 @ 240Hz |
| Storage | Up to 3x NVMe PCIe Gen4 x 4 | M.2 key-M 2280 Optional power-loss-protection NVMe is conduction cooled Each 2nd/3rd NVMe precludes one Hailo-8 key-M |
| LAN | Up to 4x 2.5 GbE (Intel I226) | 4x RJ45 (NIO R8000 4X25) | 2x RJ45 (NIO R7000 Basic) |
| Modem | 4G / 5G (Quectel) | Up to 4x SMA antennas Optional and upgradable (M.2 key-B 3042 / 3052) |
| USB | Up to 1x USB 4.0 40 Gb/s 1x USB 3.2 gen 2 10 Gb/s 3x USB 3.2 gen 2 5 Gb/s |
Connectors: USB-C / USB-A |
| Console | Serial over USB | mini-USB connector |
| BIOS | AMI Aptio V | Dual SPI FLASH for redundancy Console redirection |
| Operating systems | Windows 11/IoT, Linux | Other x86 operating systems supported |
| Power | Up to 12V-60V DC | Phoenix terminal Other DC connectors available |
| Temperature range | Up to -40ºC to 85ºC | Also available in commercial temperature range |
| Enclosure | All aluminum enclosure, fanless cooling | |
| Dimensions | 60W model: 73 mm (W) x 160 mm (H) x 130 mm (D) – 1.5 liter Tile model: 29 mm (W) x 160 mm (H) x 130 mm (D) – 0.6 liter |
|
| Mounting | DIN-rail, wall, VESA, table top |
Block diagram
Related Document |
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