Custom Meta Tags - Dynamic

Hero Banner

New Product Introduction

NPI Body

TRIA SM2S-IMX95

SM2S-IMX95 - SMARC module family powered by the latest i.MX 95 Applications Processors

Front side of TRIA SM2S-IMX95 chip

The TRIA SM2S-IMX95 SMARC module family is powered by the latest i.MX 95 Applications Processors, manufactured by NXP. The processors integrates up to six Arm Cortex-A55 cores, dedicated Arm Cortex-M7 and M33 Real-Time Processors, immersive Arm Mali™ GPU, 4K capable VPU combined with Edgelock® secure enclave security. The i.MX 95 family is the first i.MX applications processor family to integrate NXP’s eIQ® Neutron neural processing unit (NPU) and a new image signal processor (ISP) developed by NXP, helping developers to build powerful, next-generation edge platforms.

TRIA SM2S-IMX95 provides fast LPDDR5 memory technology with inline ECC support, combined with up to 256GB eMMC Flash memory and high speed interfaces such as 10 Gigabit Ethernet, Dual Gigabit Ethernet, USB 3.0 and PCI Express Gen. 3. Various standard interfaces for embedded applications such as CAN-FD, dual-channel LVDS or MIPI DSI, HDMI and MIPI CSI for connecting a camera are available. An on-board Wireless Module is provided as assembly option.

The module is compliant with the SMARC 2.2 standard, allowing easy integration with SMARC baseboards. For evaluation and design-in of the SM2S-IMX95 module, Tria provides a development platform and a starter kit. Support for Linux is available (Android support available on request).

 

Highlights

  • Hexa core Arm Cortex-A55 up to 2.0GHz
  • ARM Cortex-M7 Real Time Processor at 800MHz
  • Arm Cortex-M33 Real Time Processor at 333MHz
  • NXP eIQ Neutron Neural Processing Unit
  • NXP Image Signal Processor
  • Arm Mali Graphics Processing Unit
  • Video Processing Unit up to 4k decode/encode
  • Up to 16GB LPDDR5 SDRAM with inline ECC
  • Up to 256GB eMMC Flash
  • Dual-channel LVDS / MIPI-DSI x4
  • HDMI interface
  • Dual MIPI CSI-2 Camera Interface
  • 2x PCI Express x1 Gen. 3
  • 2x USB 3.0 Host interface
  • 2x USB 2.0 Host interface
  • 1x USB 2.0 Host/Device interface
  • 2x Gigabit Ethernet
  • 10 Gigabit Ethernet
  • Wireless Module
  • 1x MMC/SD/SDIO interface
  • 2x CAN-FD Interface
  • 2x I2S Audio Interface
  • 14x GPIO
  • UART, SPI, I2C
  • SMARC 2.2 Compliant
  • Features are dependent on processor SKU and module variant selection

 

 

Body Content Spots

Supplier Logo

Content Spots

Document



Have a question?

Get in touch:
Click here to find contact information for your local Avnet Silica team.