New Product Introduction

Teledyne e2v DDR4

DDR4 memory optimized for space apps - ultra high density memory solution, targeting space embedded systems & applications

Teledyne e2v DDR4 space memory - front and back side

The 4/8GB Radiation Tolerant DDR4 Memory Multi-Chip Package (MCP) is a Ultra High Density Memory Solution, targeting Space Embedded Systems & Applications.

The advanced DDR4 memory optimized for space applications delivers superior performance while occupying minimal board space, making it indispensable for compact satellite designs. It seamlessly integrates with processors and FPGAs featuring DDR4 controllers and is included in the Teledyne e2v Space version of the Qormino® Common Compute Platform, alongside the Space variant of the LS1046 quad-core processor (QLS1046-4GB).

Alongside the DDR4 memory, a comprehensive radiation and application data package is provided, empowering designers to swiftly and confidently develop their boards with minimal risk.

 

Space key features

  • Space Qualification
  • Up to NASA Level 1 (based on NASA EEE-INST-002 – Section M4 – PEMs)
  • Up to ECSS Class 1 (ECSS-Q-ST-60-13C)

Radiation tolerance

  • SEL LET Threshold > 60.88 MeV.cm²/mg
  • SEU evaluated from LET 2.6 MeV.cm²/mg & Upset cross-section @ 60.88 MeV.cm²/mg = 8.73E-12 cm²/bit
  • SEFI evaluated from LET 2.6 MeV.cm²/mg & SEFI cross-section @ 60.88 MeV.cm²/mg = 4.17E-4 cm²/device
  • TID: 100 krad(Si)

High performances, compact and fault tolerant

  • 4GB and 8GB densities
  • 72 bits bus width - (Can typically be used as 64 bits data + 8 bits ECC, offering single-bit error correction, and dual-bit error detection)
  • 2.1 GT/s and 2.4GT/s (up to 150Gbps) transfer speeds
  • Dimensions 15mm x 20mm x 1.92mm
  • Temperature range [-40 ; +105]°C or [-55 ; +125]°C

 

The World’s most compact Radiation Tolerant DDR4 memory for space systems

Teledyne e2v Semiconductors unveils the most compact Radiation Tolerant DDR4 memory designed for space systems, offering a comprehensive application data package. It serves as the perfect high-speed companion chip for Teledyne e2v’s Space Grade Processors or third-party Space FPGAs. This memory demonstrates exceptional resilience in the harshest conditions, remaining operational despite extreme temperature fluctuations and radiation exposure.

 

 

Links & Documents


Related Videos

How to Set up DDR4 with Xilinx Devices


Demonstration of DDR4 with Xilinx Kintex Ultrascale FPGA


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