STMicroelectronics ISM330DHCX

The ISM330DHCX is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DHCX the sensing elements of the accelerometer and of the gyroscope are implemented on the same silicon die, thus guaranteeing superior stability and robustness.

The ISM330DHCX has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of applications.

All the design aspects and the calibration of the ISM330DHCX have been optimized to reach superior accuracy, stability, extremely low noise and full data synchronization.

An unmatched set of embedded features (Machine Learning Core, programmable FSM, FIFO, sensor hub, event decoding and interrupts) are enablers for implementing smart and complex sensor nodes which deliver high performance at very low power.

The ISM330DHCX is available in a 14-lead plastic land grid array (LGA) package.

Features

• ​3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
• 3D gyroscope with extended selectable full scale: ±125/±250/±500/±1000/±2000/±4000 dps
• Extended temperature range from -40 to +105 °C
• Embedded compensation for high stability over temperature
• SPI/I²C serial interface
• Auxiliary SPI serial interface for data output of gyroscope and accelerometer (OIS and other stabilization applications)
• Six-channel synchronized output
• Sensor hub feature to efficiently collect data from additional external sensors
• Embedded smart FIFO up to 9 kbytes
• Programmable Finite State Machine to process data from accelerometer, gyroscope, and external sensors
• Machine Learning Core
• Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click
• Embedded pedometer, step detector and counter for healthcare applications
• Analog supply voltage: 1.71 V to 3.6 V
• Embedded temperature sensor
• Embedded self-test both for gyroscope and accelerometer
• High shock survivability
• ECOPACK, RoHS and “Green” compliant

STEVAL-PROTEUS1 - Industrial sensor evaluation kit for condition monitoring based on the 2.4 GHz STM32WB5MMG module

The STEVAL-PROTEUS1 is an evaluation tool designed for temperature and vibration monitoring. It is based on a 2.4 GHz multiprotocol wireless SoC to address machine or facility condition monitoring for industrial applications. The evaluation board simplifies the prototyping, evaluation and development of wireless industrial sensor nodes to enable the predictive maintenance. It comes with a LiPo battery and a plastic case. All components are mounted exclusively on the top side of the PCB to ensure an easy mounting on other equipment. The included comprehensive software and the firmware libraries with time and frequency domain vibration analysis ease your software customization and can reliably improve your time-to-market.

The main board includes the STM32WB5MMG ultra-low-power and small form factor wireless radio module. This module is FCC and IC certified (FCC ID: YCP-STM32WB5M001 and IC: 8976A-STM32WB5M01). It is based on the STM32WB55VGY wireless SoC, compliant with the Bluetooth® Low Energy SIG specification v5.2, ZigBee 3.0, and IEEE 802.15.4-2011.

The powerful Arm®-based Cortex-M4 with FPU and large memory allows running the embedded algorithm at node level.

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