STMicroelectronics IMP23ABSU

The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing element and an IC interface.

The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.

The IMP23ABSU has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio. The sensitivity of the IMP23ABSU is -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.

The IMP23ABSU is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

Key features

• Single supply voltage operation 1.52 V - 3.6 V
• Omnidirectional sensitivity
• High signal-to-noise ratio
• High acoustic overload point: 130 dBSPL typ.
• Package compliant with reflow soldering
• Enhanced RF immunity
• Ultra-flat frequency response
• Ultrasound bandwidth (up to 80 kHz)
• Low latency
• Ultra-low-power: 150 µA max.
• ECOPACK, RoHS, and “Green” compliant

STEVAL-MIC007V1 - Microphone coupon board based on the IMP23ABSU analog MEMS microphone

The STEVAL-MIC007V1 is a daughterboard containing 4 IMP23ABSU MEMS microphones.

The coupon concept allows easy performance testing of ST MEMS microphones. It is possible to detach the single PCBs hosting each microphone.

 

Key features

• 4 x IMP23ABSU bottom port analog MEMS microphones
• Vsupply from 1.52 to 3.6 V
• 130 dBSPL acoustic overload point
• Omnidirectional sensitivity
• Enhanced RF immunity
• Ultrasound bandwidth (up to 80 kHz)
• Ultra-low-power: 150 μA max
• Sensitivity -38 dBV ±1 dB
• RoHS compliant

STEVAL-STWINKT1B - STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications

The STWIN SensorTile wireless industrial node (STEVAL-STWINKT1B) is a development kit and reference design that simplifies prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.

The kit features a core system board with a range of embedded industrial-grade sensors and an ultra-low-power microcontroller for vibration analysis of 9-DoF motion sensing data across a wide range of vibration frequencies, including very high frequency audio and ultrasound spectra, and high precision local temperature and environmental monitoring. The development kit is complemented with a rich set of software packages and optimized firmware libraries, as well as a cloud dashboard application, all provided to help speed up design cycles for end-to-end solutions. The kit supports Bluetooth® low energy wireless connectivity through an on-board module, and Wi-Fi connectivity through a special plugin expansion board (STEVAL-STWINWFV1). Wired connectivity is also supported via an on-board RS485 transceiver. The core system board also includes an STMod+ connector for compatible, low cost, small form factor daughter boards associated with the STM32 family, such as the LTE Cell pack. Apart from the core system board, the kit is provided complete with a 480 mAh Li-Po battery, an STLINK-V3MINI debugger and a plastic box.

 

Key features

• Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
• Updated version of STEVAL-STWINKT1, now including STSAFE-A110 populated, BlueNRG-M2S module and IMP23ABSU MEMS microphone
• Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
• Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9)
• Micro SD Card slot for standalone data logging applications
• On-board Bluetooth® low energy v5.0 wireless technology and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
• Option to implement Authentication and Brand protection secure solution with STSAFE-A110
• Wide range of industrial IoT sensors:
  • ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
  • 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
  • ultra-low-power high performance MEMS motion sensor (IIS2DH)
  • ultra-low-power 3-axis magnetometer (IIS2MDC)
  • digital absolute pressure sensor (LPS22HH)
  • relative humidity and temperature sensor (HTS221)
  • low-voltage digital local temperature sensor (STTS751)
  • industrial grade digital MEMS microphone (IMP34DT05)
  • analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)
• Modular architecture, expandable via on-board connectors:
  • STMOD+ and 40-pin flex general purpose expansions
  • 12-pin male plug for connectivity expansions
  • 12-pin female plug for sensing expansions
• Other kit components:
  • Li-Po battery 480 mAh
  • STLINK-V3MINI debugger with programming cable
  • Plastic box

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