Integrating Bluetooth® Low Energy (LE) doesn’t have to be complicated. Renesas simplifies the process with highly integrated, ultra-low power SoCs and certified Bluetooth LE modules.
Designed for seamless integration, our solutions eliminate the challenges of component selection, RF design, and regulatory certifications. They deliver proven compliance with Bluetooth standards while enabling best-in-class low power performance and cost-effective designs.
With Renesas, you can accelerate development and bring reliable, energy-efficient Bluetooth LE products to market faster.
Featured products
DA14592
The DA14592 is a very low-power, BLE SoC offering M33 + M0 ARM Cortex cores supporting floating point application programming (M33) and Renesas-programmed, BLE 5.4 and capable of supporting other (proprietary), ISM band protocols. New for Renesas BLE, it includes embedded Flash and its memory (Flash/ROM/RAM) and functionality has been optimized to cost-efficiently support a broad range of BLE applications.
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DA14695
The SmartBond™ DA1469x family of Bluetooth® Low Energy solutions is a feature-rich range of multi-core microcontroller units for wireless connectivity.
The product family builds off the successes of Renesas' SmartBond line, boasting three additional cores that offer greater processing power, resources, range, and battery life, enabling developers to push the boundaries of a wide array of connected consumer applications. The DA1469x line provides developers with advanced connectivity features to future-proof their devices and fit the needs of multiple applications.
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