EBV, Renesas and Tria On Demand Webinar | EBV Elektronik

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EBV, Renesas and Tria On Demand Webinar | EBV Elektronik

EBV, Renesas & Tria On Demand Webinar | Time to Market Optimisation with Renesas MPU on TRIA SMARC Modules

Online, On Demand


Register Now!

 

Renesas Tria Webinar

 

 

Live Presentation Date: February 25, 2025 
 

Join our experts from EBV, Renesas, and Tria for an exclusive on demand webinar exploring the RZ/G2 and RZ/V2 families. Discover how these solutions accelerate your time-to-market with comprehensive hardware and software support.

TRIA now offers the RZ/G2 and RZ/V2 on a SMARC module, enabling faster time-to-market for your products. Developed by the SGeT consortium, the SMARC form factor ensures flexibility, compatibility, and scalability—enabling future evolution while preserving your existing carrier board design.

Take advantage of this opportunity to integrate the Renesas MPU family into your device and make the best use of the SMARC module for a fast, secure, and future-ready design!
 

Learn more about the key Features of RZ MPUs and value to respond the market needs: 
 

  • The high computational power based on powerful ARM cores
  • The high scalability with memory configurations and features to support diverse applications
  • The advance graphics supported by embedded GPUs or graphic accelerators for HMI applications
  • The AI and Edge Computing enabled by AI accelerators

They are all surrounded by a comprehensive peripheral interfaces set and communication options, and finally a built-in security features such as secure boot, hardware cryptography, and trusted execution environments enhance system integrity and data protection.
 

Speakers:

Ulrich Schmidt
- Segment Director Embedded Processing, EBV Elektronik

Ulrich started his career in 1990 as a Systems Engineer at Texas Instruments in the RF-ID Division. Since 1999, he specialized in TI's DSP, MPU and SoC products as a Field Application Engineer. Before joining EBV as a Field Application Engineer in 2014, he was Technology Manager at E.ON responsible for the support and implementation of smart home appliances. Ulrich is leading the High-End Processing segment at EBV since 2018 to implement technology topics both on device level and on software (embedded SW, AI/ML, operating systems, etc.).
 

Stefano Tansini - Director, Embedded Processing Business Development, Renesas Electronics

Stefano is a seasoned technology market expert with extensive experience in the semiconductor and electronics industries. He currently serves as the Director of Embedded Processors Product Team (MCU & MPU) and as Italy Branch Manager at Renesas Electronics. With deep expertise in the RZ MPU product family, Stefano helps customers develop innovative solutions across diverse applications such as IoT, industrial automation, and AI-driven systems. In the recent past he was responsible for RZ MPU Biz Dev & Application Engineering department for EMEA and US.  Before joining Renesas Electronics, Stefano Tansini worked with ALENIA Space, ITALTEL, SIEMENS, NEC. His current focus is to drive innovation and deliver cutting-edge MCU & MPU solutions to EMEA market including SOM/SBC market biz development with special focus on AI applications. 


Andreas Hitzler - Senior Product Marketing Manager Boards, Tria Technologies

Andreas is Senior Product Marketing Manager for Board Solutions at Tria Technologies, an electronic manufacturing company dedicated to build solutions that meet the future demand of innovation and quality with reduced time to market utilizing our platform technologies and design & manufacturing capabilities. Prior to joining TRIA, Andreas worked as a Hardware Design Engineer developing embedded computer boards and modules in the spaces of communication and industrial market for more than fifteen years. Andreas is responsible for the SMARC Product Portfolio of TRIA and enjoys helping customers to find the most suitable and cost-effective solution for their end application.
 

 

EBV, Renesas and Tria On Demand Webinar | EBV Elektronik

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