1200 V TRENCHSTOP™ IGBT7 - Higher power density and optimized switching
Based on the latest micro-patter trenches technology, the 1200 V TRENCHSTOP™ IGBT7 and EC7 diode offer strongly reduced losses and high levels of controllability. This device is optimized for industrial drive applications. Therefore, it enables lower static losses, higher power density, and softer switching.
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EconoDUAL™ 3 (half-bridge for medium power)
![Image of INF_econodual- 3 Image of INF_econodual- 3](/wcm/connect/d427253c-6d3f-48d6-80bd-d8c98a85021d/INF_econodual-3_image.jpg?MOD=AJPERES&CACHEID=ROOTWORKSPACE-d427253c-6d3f-48d6-80bd-d8c98a85021d-nqBEDYZ)
EconoDUAL™ 3 modules are now available with the latest TRENCHSTOP™ IGBT7 generation, extending the 1200 V portfolio from 600 A up to 900 A. The 900 A 1200 V EconoDUAL™ features an improved housing for handling higher currents, and temperatures within the same footprint. In combination with the TRENCHSTOP™ IGBT7 technology, it shows a significant reduction of losses, a high level of controllability and switching softness, as well as high short-circuit capability. Together with the maximum operation temperature of 175°C at overload, high efficiency and power density are achieved, enabling system simplification, and cost reduction.
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CoolSiC™ 1200 V SiC Trench MOSFET in TO-263-7 package
![Image of INF coolsic mosfet Image of INF coolsic mosfet](/wcm/connect/c577498f-4517-4a16-96b5-ce9e384e335a/INF_coolsic_mosfet_image.jpg?MOD=AJPERES&CACHEID=ROOTWORKSPACE-c577498f-4517-4a16-96b5-ce9e384e335a-oMlPnxY)
The CoolSiC™ 1200 V, 30 mΩ SiC MOSFET in a D2PAK-7L (TO-263-7) package build on a state-of-the-art trench semiconductor process optimized to combine performance with reliability in operation. The low power losses of CoolSiC technology, combined with .XT interconnection technology in a new 1200 V optimized SMD package, enables top efficiency and passive cooling potential in applications such as drives, chargers and industrial powers supplies.
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- IMBG120R030M1H - CoolSiC™ 1200 V SiC Trench MOSFET in TO-263-7 package
EiceDRIVER™ X3 Compact and Enhanced family
EiceDRIVER™ X3 Compact and Enhanced family
![Image of INF eicedriver-x3 Image of INF eicedriver-x3](/wcm/connect/3226f411-ec7e-4c8d-97c0-300b4f66eaff/INF_eicedriver-x3_image.jpg?MOD=AJPERES&CACHEID=ROOTWORKSPACE-3226f411-ec7e-4c8d-97c0-300b4f66eaff-oMlPwch)
The EiceDRIVER™ X3 Compact isolated gate driver family now includes the X3 Compact 1ED31xx family, with a Miller clamp or separate output function. The active Miller clamp function is highly recommended for SiC MOSFET 0 V turn off. Up to 14 A output current, 200 kV/µs CMTI, 7 ns Max. propagation delay matching, 40 V max output supply voltage. Integrated filters reduce the need for external filters.
The EiceDRIVER™ X3 Enhanced isolated gate driver portfolio now includes X3 Analog 1ED34xx family and X3 Digital 1ED38xx family with DESAT, Miller clamp, Soft-off, and I2C configurability. This highly-flexible gate driver family offers a wide range of configurable features and monitoring options. This enables innovative use cases, such as predictive maintenance.
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- 1ED3124MU12H - 14 A, 5.7 kV (rms) single-channel isolated gate driver with separate output, UL 1577 certified, 10.5 V UVLO
- 1ED3491MU12M - 5.7 kV, 9 A single-channel flexible isolated gate driver with active Miller clamp, adjustable DESAT and Soft-off
Further well established gate drivers:
- 1ED44176N01F – 25 V, 1.75 A – Single low side driver with OCP
- 1ED020I12-F2 – 1200 V, 2 A – Isolated driver with DESAT and Miller clamp
- 1EDC60H12AH – 1200 V, 10 A – Isolated driver with separate output
- 1EDI30I12MF – 1200 V, 6 A – Isolated driver with Miller clamp
32-bit XMC™ Industrial Microcontroller based on Arm® Cortex®-M
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XMC1000 microcontrollers bring together the Arm® Cortex®-M0 core and market proven and differentiating peripherals in a leading-edge 65nm manufacturing process. XMC1000 is the number one choice to bring traditional 8-bit designs to the next level. All XMC4000 devices are powered by Arm® Cortex®-M4 with a built-in DSP instruction set. The Single Precision Floating Point Unit, Direct Memory Access (DMA) feature and Memory Protection Unit (MPU) are state-of-the-art for all devices – even the smallest XMC4000 runs with up to 80MHz in core and peripherals. It comes with comprehensive set of common, fast and precise analog/mixed signal, Timer/PWM and communication peripherals.
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NOR Flash
![Image of INF_nor-flash Image of INF_nor-flash](/wcm/connect/e0819aa5-f73b-4a10-bcad-add681f485ed/INF_nor-flash_image.jpg?MOD=AJPERES&CACHEID=ROOTWORKSPACE-e0819aa5-f73b-4a10-bcad-add681f485ed-oMlPFoy)
NOR Flash is the ideal memory for code storage in embedded systems due to its fast random read performance. This performance also supports XIP (eXecute In Place) functionality which allows host controllers to execute code directly from the NOR Flash Memory without needing to first copy the code to a RAM. Higher levels of Serial NOR Memory performance have enabled XIP to be used on a wide variety of designs in many applications.
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