onsemi Advanced 3x3 Source Down Dual Cool T10 Power MOSFETs

onsemi power trench 10 technology performs lowest Figure-of-Merit in high switching frequency application. To comply with application requirement, the T10/80V, T10/40V and T10/25V technologies are adopted. Besides, high density and higher thermal performance can also be enhanced with onsemi’s 3x3 source down dual cool package. This advanced die and package technologies are provided by onsemi to fulfill this AI datacenter IBC application.

Key features

• Advanced source−down center gate dual−cooling package technology (3.3x3.3mm)
• Ultra-low R_DS(on) for reduced conduction losses and improved efficiency
• Low Q_G and capacitance
• Dual-sided thermal path for higher power dissipation

Applications

• Intermediated Bus Converter (IBC)
• Synchronous rectifier
• Industrial power supplies
• Data-center and cloud power systems
• Motor drives