Infineon Technologies EasyPACK™ CoolSiC™ automotive MOSFET

EasyPACK™ 1B is a 7.33 mΩ half-bridge module combining the new CoolSiC™Automotive MOSFET 1200V technology, an NTC temperature sensor, and the proven PressFIT

EasyPACK™ 1B is a 7.33 mΩ half-bridge module combining the new CoolSiC™Automotive MOSFET 1200V technology, an NTC temperature sensor, and the proven PressFIT contact technology. With the full automotive qualification, the field of applications for CoolSIC™ is now extended to high voltage automotive applications with high efficiency and switching frequency requirements, such as HV/HV DC-DC step-up converters, multiphase inverters, and fast-switching auxiliary drives like fuel-cell compressors.

 

Key features

• High gate threshold voltage preventing parasitic turn-ON (Vth = 4.4 V)
• IGBT compatible driving voltage (V_GS = -5/+15 V)
• Intrinsic diode with low reverse recovery
• R_DS(ON) = 7.33 mΩ (typical)

 

Additional features

• Low stray inductance 5 nH
• Blocking voltage 1200 V
• Low switching losses
• Low Q_g and C_rss
• T_vjop = 150 °C
• Integrated NTC temperature sensor
• RoHS compliant
• Easy system assembly (PressFIT contact technology for solder-less mounting)
• Easy design (Integrated module solution with optimized thermal management)
• Superior reliability (gate oxide and cosmic ray robustness)
• Flexibility (half-bridge concept for flexible inverter design)
• Automotive qualified according to AQG 324

 

Applications

• Hybrid and Electric Vehicles
• Commercial, Construction and Agriculture Vehicles
• HV/HV DC-DC Converters
• Main Inverters
• Auxiliary Drives

ebv content library/npi/2020/infineon-easypack-coolsic-ff08mr12w1ma1_b11a Infineon EasyPACK™ Cool SiC™ FF08MR12W1MA1_B11A | EBV Elektronik