Nexperia: Innovations and New Design Tools for Robust Automotive MOSFET Designs

Online, On Demand

Live Presentation Day: November 16, 2021

Overview 

Nexperia has release two new product technologies to address the application trends seen in the automotive marketplace: the LFPAK56D half-bridge package, and repetitive avalanche MOSFETs.

The LFPAK56D half-bridge product offering and portfolio address the growing trend in automotive application of half-bridge configuration (high side/low side MOSFETs) due to the innovative clip technology used within the package. Whether this is a three-phase motor control application or DCDC conversion application, it occupies 30% less PCB space compared to a conventional LFPAK56D dual device, with 60% less parasitic inductance due to the internal clip connection.

In the LFPAK56D dual package, Nexperia has also released a new application specific MOSFET (ASFET) technology - automotive ASFETs for repetitive avalanche. This technology, designed to drive solenoids and actuators, but suitable for other inductive loads, has been tested to one billion repetitive events.

In this session we will review both of these technologies and Nexperia's recently released interactive application notes (IANs) which give you the opportunity to simulate these silicon technologies in your applications.

Key takeaways

• Discover LFPAK half-bridge (copper clip package) innovation and benefits
• Explore design flexibility with portfolio expansion into new application spaces
• Review how to simplify designs and find system level cost savings (e.g. smaller PCB footprint, reduced component count)
• Learn about new interactive applications notes, enabling modeling and visualization of the design prior to implementation

Speaker

Richard Ogden, MOSFET Product Manager, Nexperia

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