Nexperia: Package Transition in Power Diodes | EBV Elektronik

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Nexperia: Package Transition in Power Diodes | EBV Elektronik

EBV & Nexperia | Package Transition in Power Diodes

Online, On Demand


Live presentation date: July 19, 2023 
 

Join us In this 1 hour session and together with our expert,  Achim Baum gain an insight into Nexperia's extensive portfolio of Power diodes, including highly efficient Schottky rectifiers, hyperfast and ultrafast recovery rectifiers or silicon germanium with cutting-edge efficiency and thermal stability. These Power diodes are offering the best performance in the smallest footprint.

Driven by an increased requirements in efficiency, power capability and space constrains over the last years  Power diodes in mature packages have been replaced with more efficient clip bond flat Power Packages on new designs. This increased market demand is leading to a market wide trend in Package transition towards flat power Packages, taking into account technical performance but also longevity and supply constrains compared to legacy packages. During the webinar, the recommended replacement packages are shown and compared with the legacy packages.

Nexperia's Power diodes in clip-bonded FlatPower (CFP) packages combine efficient power conversion and a space-saving design. Nexperia has a clear strategy to further widen the Portfolio in CFP, provide capacity and support customer application designs.

 


Key Takeaways
 

  • Nexperias different Power diode technologies and advantages
  • Market package trend for Power diodes
  • Recommended packges for transition 

     

Speaker:

  • Achim Baum | Business Marketing Manager, Power Bipolar, Nexperia

Achim Baum is responsible for medium and high power silicon-based rectifiers and BJTs. He joined Nexperia in 2021 after working in distribution and gained broad experience in the component business as well as Automotive and Industrial applications.


 

 

Register Now

Nexperia: Package Transition in Power Diodes | EBV Elektronik

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