Custom Meta Tags

EBV - Kioxia - E-MMC Hero Banner (HB)

High-Density Flash Memory by KIOXIA

Static HTML

Embedded mass storage at the next level with KIOXIA’s new e-MMC

KIOXIA’s new e-MMC utilizing the next generation of 3D flash memory technology offer an even more cost efficient and reliable managed memory solution.

Since the announcement in 2007 and the start of mass production in 2016, the ground-breaking new and innovative BiCS FLASH™ 3D flash memory technology represents the best possible solution for cost efficient and long-lasting data storage.

KIOXIA BiCS FLASH™ 3D flash memory technology with 64-, 96-, 112- and 162-layer stacking makes a powerful memory solution possible. It gives BiCS FLASH™ far higher die area density compared to 2D NAND. BiCS FLASH™ reduces the chip size by optimizing both circuit technology and the manufacturing process. As a result, this technology can achieve a similar reliability as 2D MLC (2bit/cell) while utilizing 3D TLC (3bit/cell) structure.

The evolution of this 3D flash memory technology is continuously introducing new generations of flash, which offers further improvements in terms of cost efficiency and performance.

As this advantage is getting even more relevant, the higher the density gets. KIOXIA is now introducing two new e-MMCs with densities of 64GB and 128GB utilizing a BiCS FLASH™ 3D flash memory technology with 96 layers, versus the current generation with 64 layers.

Key advantages of the new generation of 3D Flash based e-MMC:

Improved cost per Gigabyte ratio
Extended longevity until 2026
Optimised internal controller for reduced WAF (Write Amplification Factor)
Faster transition time from Idle to Auto Sleep
At initial state, the protection for pre-loaded date of max 33% of ttl. capacity is already active
Larger RPMB Area available up to 16MB