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KIOXIA

The Inventor of Flash Memory

KIOXIA Europe GmbH (formerly Toshiba Memory Europe GmbH) is the European based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs). In 1984 Toshiba invented a new type of semiconductor memory called flash memory. Later in 1987, NAND flash memory was developed that raised electronic equipment to the next level. From the invention of flash memory to today’s breakthrough BiCS FLASHTM 3D flash memory, KIOXIA continues to provide embedded memory solutions for all kind of applications like consumer electronics, mobile technology, automotive and industrial applications such as robotics.
 

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RAW NAND

With raw NANDs like SLC NAND, BENAND™ and Serial NAND KIOXIA provides high endurance and data retention for sensitive or frequently used data.

 

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SLC NAND

Reliability and Performance

KIOXIA’s advanced Flash Memory technology offers SLC NAND providing best in class endurance and data retention for sensitive or frequently used data in a system. For long lasting products or systems working with extremely high data throughput between the host and the memory, KIOXIA SLC is the optimal solution.

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SPECIFICATIONS
FEATURES SLC NAND
Density 1 Gbit − 256 Gbit
Technology 24nm
ECC (Error Correction Code) Required on Host Side
Temperature

-40°C to 85°C
0°C to 70°C
Package TSOP and BGA

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BENAND™

SLC NAND with embedded ECC

BENAND™ (Built-in ECC NAND) is a SLC NAND memory device which has an internal hardware ECC engine. Using BENAND™ it is possible for customers to use the 24nm SLC NAND flash memory technology even when their platform cannot support higher bit ECC.

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SPECIFICATIONS
FEATURES BENAND™ (SLC+ECC)
Density 1 Gbit − 8 Gbit
Technology 24nm
ECC (Error Correction Code) Embedded on Memory Chip
Temperature

-40°C to 85°C
0°C to 70°C
Package TSOP and BGA

KIOXIA_X6-brochure_BENAND_chart

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SERIAL NAND

SLC NAND with Serial Peripheral Interface (SPI)

KIOXIA’s new line-up of 24nm-based Serial NAND flash memory products is compatible with the widely used Serial Peripheral Interface, giving users access to SLC NAND flash memory with a low pin count, small package and large capacity.

 

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SPECIFICATIONS
FEATURES SERIAL NAND
Density 1 Gbit − 8 Gbit
Technology 24nm
Interface Quad-SPI (Serial Peripheral Interface)
ECC (Error Correction Code) Embedded on Memory Chip
Temperature

-40°C to 85°C
Package 8 pin WSON

KIOXIA_X6-brochure_SERIAL-NAND_chart

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MANAGED NAND

For efficient and easy to integrate storage systems, managed NAND like e-MMC and UFS are the preferred solutions. Offering broadly accepted standard interfaces and packages, in combination with high speed interfaces, they are the optimal selection for many applications in the industrial, mobile and automotive market.

 

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e-MMC

Highly-efficient Storage

e-MMC is a family of advanced and highly efficient NAND flash memories with an integrated controller for enhanced memory management. Based on an interface standardized by JEDEC, KIOXIA’s e-MMC offers the optimal solution for applications where higher data volumes need to be stored in an efficient way.

 

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SPECIFICATIONS
FEATURES e-MMC EXTENDED TEMP. e-MMC
Density 4 GB – 128 GB 8 GB – 64 GB
Technology 15nm / BiCS FLASH™ 15nm
JEDEC Version 5.0 / 5.1 5.1
Temperature

-25°C to 85°C

 -40°C to 105°C
Package 153 ball FBGA (11.5 x 13 mm)

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UFS

High Performance Storage

For applications demanding a superior interface performance, KIOXIA is offering a broad line-up of new UFS Memory products. Utilizing a full duplex serial high-speed interface, it is compliant with the latest UFS Version 2.1, 3.0 and 3.1. In combination with the embedded memory management, it offers a highly efficient and excellent performing storage solution. UFS memory with Version 3.1 enables next generation mobile devices to take full advantage of the connectivity benefits of 5G, leading to faster downloads and reduced lag time – and improved user
experience.

 

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SPECIFICATIONS
FEATURES UFS – UNIVERSAL FLASH STORAGE
Density 32 GB – 1 TB
Technology BiCS FLASH™
JEDEC Version 2.1 / 3.0 / 3.1
Temperature

-25°C to 85°C
Package 153 ball FBGA (11.5 x 13 mm)

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KIOXIA – Embedded Flash Memory Line-Up Overview

Density Bit per Cell Technology
in GByte in Gbit 2D-SLC 2D-MLC managed 3D–TLC managed
 

1Gb

Raw SLC

 BENAND

Serial NAND

    
2Gb Raw SLC BENAND Serial NAND
4Gb Raw SLC BENAND Serial NAND
8Gb Raw SLC BENAND Serial NAND
16Gb Raw SLC  
4GB 32Gb Raw SLC   e-MMC
8GB 64Gb Raw SLC   e-MMC
16GB 128Gb Raw SLC   e-MMC e-MMC  
32GB 256Gb Raw SLC   e-MMC e-MMC UFS
64GB     e-MMC e-MMC UFS
128GB       e-MMC UFS
256GB         UFS
512GB         UFS

1TB (1024GB)

         UFS

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