Switches & drivers based on Gallium nitride technology
CoolGaN™ 600 V e-mode HEMTs - highest efficiency & density levels in SMPS
With CoolGaN™, Infineon launches a GaN enhancement mode high electron mobility transistor (e-mode HEMT) portfolio with industry-leading field performance, enabling rugged and reliable systems at an attractive overall system cost. CoolGaN™ transistors are built with the most reliable GaN technology and are tailor-made to deliver the market’s highest efficiency and density levels in switched mode power supplies. The application-based qualification approach extends beyond that of other GaN products in the market.
The e-mode (normally-off) concept is a single-chip solution and hence facilitates further integration either on the chip or package level. Infineon brought its e-mode concept to the maturity, required for demanding applications, delivering at the same time the highest performance among all available GaN HEMTs.
GaN switch performance features low charge and excellent dynamic performance in reverse conduction compared to silicon FET options. This enables more efficient operation at existing frequencies, and much higher frequency operation which can improve power density by shrinking the size of passive components. Infineon’s CoolGaN™ 600 V impresses with highest PFC efficiency (>99.3% for 2.5 kW PFC) and highest density for same efficiency (>160 W/in3 for 3.6 kW LLC with >98% efficiency).
The CoolGaN™ portfolio is built around high performing SMD packages with lower parasitics and good thermal performance to fully exploit the benefits of GaN both, for bottom-side cooling (DSO-20-85) and top-side cooling (DSO-20-87). By offering a full SMD package series Infineon aims to support high frequency operations.
Infineon’s qualification plan for its GaN switches follows a dedicated approach well beyond Si standards (e.g. JEDEC), thereby setting the next level of wide bandgap quality. Application profiles (including most stringent and challenging applications requiring more than 15 years lifetime, e.g. server / telecom) are an integral part of the qualification. Failure models – based on accelerated test conditions – ensure that in the field a target lifetime and quality are met.
Target applications: servers, data centers, telecom, wireless charging, chargers, adapters
Key features |
Key benefits |
- Best FOM of 600 V power devices
- Excellent for hard and soft switching topologies
- Optimized for turn-on and turn-off
- Zero reverse recovery charge
- The cutting-edge technology for innovative solutions and high volumes
Compared to Si technology:
- 10x higher breakdown field and 2x higher mobility
- 10x lower output charge
- 10x lower gate charge and linear Coss characteristic
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- Highest efficiency for SMPS; excellent efficiency in resonant circuits
- Highest power density enables small and light designs
- Surface mount (SMD) packaging ensures that switching capabilities of GaN are fully accessed
- Easy-to-use thanks to a compelling driver IC portfolio
- Very low RDS(on) and large cost-down potential
- New topologies and current modulation
- Fast (and nearly lossless) switching
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CoolGaN™ 600 V e-mode HEMTs product portfolio
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EBV - Infineon Switches and Drivers - Gallium Nitride Technology (LC)