The TO-247 4-pin package with asymmetric leads is an optimized version of the standard TO-247 4-pin, and enables highest efficiency and controllability in the high power SMPS market. The fourth pin acts as a Kelvin source. The main current of the switch is placed outside of the gate loop and the feedback is eliminated.
With a very small footprint of only 64 mm² (vs. 150 mm² for the D²PAK), and a very low profile with only 1 mm height (vs. 4.4 mm for the D²PAK), the ThinPAK 8x8 leadless SMD package for high voltage MOSFETs is a first choice to decrease system size in power density driven designs. Low parasitic inductance and a separate 4-pin Kelvin source connection offer best efficiency and ease-of-use.
Combined with the latest CoolMOS™ C7 Gold (G7) technology, the TO-Leadless (TOLL) package is Infineon’s flagship SMD package for high power/high current SMD solutions. Compared to D2PAK 7-pin, TO-Leadless shows 30 percent reduction in footprint, yet offers improved thermal performance. This and the 50 percent height reduction result in a significant advantage whenever highest power density is demanded. Equipped with 4-pin Kelvin source connection and low parasitic inductances, the package offers best efficiency and ease of use.
This is the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. SMD based SMPS designs support fast switching and help to reduce the parasitic inductance associated with long leaded packages such as the common TO-220 package. In today’s SMD based designs, the output power is restricted by the thermal limit of the PCB material because the heat must be dissipated through the board. Thanks to the top-side cooling concept of DDPAK, the thermal decoupling of board and semiconductor is possible, enabling higher power density or improved system lifetime.
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