Nexperia LFPAK88 Trench 9 40 V Automotive MOSFETs

Providing a true alternative to D²PAK, Nexperia’s LFPAK88 delivers industry-leading power density in a truly innovative 8 x 8 mm footprint

Providing a true alternative to D²PAK, Nexperia’s LFPAK88 delivers industry-leading power density in a truly innovative 8 x 8 mm footprint. Delivering 2 x higher continuous current rating, ultimate thermal performance and reliability, and up to 60% space-saving efficiency, making LFPAK88 the MOSFET of choice for the most challenging new designs. The Trench 9 40 V Automotive MOSFETs are among others suitable for applications like power steering, braking, LED lighting, DCDC, and reverse battery protection. The released portfolio offers low RDSon from 0.7 - 1.5 mΩ and is beyond automotive AEC-Q101 qualified to 175 °C.

 

Key features

• Beyond automotive AEC-Q101 qualified to 175 °C
• Low _RDS(ON) from 0.7 to 2.5 mΩ in various LFPAK packages
• SOT1235 (LFPAK88) replacing larger packages such as (D²PAK, D²PAK-7, TOLL, TOLG, etc.)
• 48 x power density compared to wire bonded equivalents

 

Additional features

• Advanced package design exceeds 2 x AEC-Q101
• Compact 8 x 8 mm footprint
• Ultra-low ON-resistance
• Copper clip technology ensures low electrical and thermal resistance
• Best-in-class linear mode (SOA) performance in-rush and surge protection
• Combining the clip bond LFPAK package and the low R_DS(ON) Trench 9 technology to enable improved power density
• Trench 9 superjunction technology for improved avalanche robustness to enable easier designs and improved reliability
• Improved V_GS(th) for better paralleling of MOSFETs in increased power requirement applications
• Nexperia also offers an industrial LFPAK88 portfolio

 

Applications

• BLDC motor control
• 48 V DC/DC converters
• Reverse battery protection
• Engine fans and pumps
• Transmission
• Power steering
• Braking
• LED lighting

ebv content library/npi/2020/nexperia-lfpak88 Nexperia LFPAK88 Trench 9 Automotive MOSFETs | EBV Elektronik